Advanced Thermal Management Solutions

Now more than ever, devices with increasing power and smaller footprints are demanding a good stable cost effective thermal management solution. Fortunately many options are available today. However, for...

Thermoelectric Cooling

There are many places one can go to get an outline on the pros and cons of different methods for enclosure cooling. Although we will briefly touch on them here, this is really an in-depth article on how to choose a...

Maximizing Thermal Cooling Efficiencies in High-Performance Processors

Despite the continuous development of new, higher performing processors, the thirst for increased embedded computing capability remains unquenched. In fact, it seems like...

Enclosure Cooler

TECA Corp. (Chicago, IL) has introduced a powerful new thermoelectric air conditioner for enclosure cooling. The AHP-690 Model features compact dimensions and 55% more cooling capacity than coolers of similar size. As a...

Submersion and Directed Flow Cooling Technology for Military Applications

As the US military shifts from boots on the ground to drones in the sky, there will be an increasing need for computing power on foreign soil, under the sea and in the...

Thermal Trends and Improvements for Rugged COTS Cards

Thermal management of rugged COTS (commercial off-the-shelf) cards destined for defense applications has always been a challenge due to the high operating temperatures and other harsh...