Low Power 65nm FPGA
Altera Corporation (San Jose, CA) announced the shipment of the EP3C120, the largest member of its new low-cost 65nm Cyclone® III FPGA family. Leveraging Taiwan Semiconductor Manufacturing Company's (TSMC's) 65-nm low-power (LP) process, Cyclone III FPGAs offer low power, a rich supply of logic (5K to 120K logic elements), memory (up to 4 Mbits) and digital signal processing (DSP) capabilities (up to 288 DSP multipliers).
The low power consumption of the EP3C120 enables it to uniquely address power-sensitive applications or applications in thermally challenging environments where the heat generated by device operation cannot easily be dissipated, affecting product reliability and cost. The entire Cyclone III family is supported by Quartus® II software version 7.1 in both subscription and the free web editions. The advanced technology and productivity features in Quartus II software allow designers to exploit the full potential of the Cyclone III family to achieve 50 percent lower power consumption compared to the previous generation family, and three speed grades faster than the nearest low-cost FPGA competitor.
For Free Info Visit http://info.ims.ca/10976-423
Top Stories
INSIDERManned Systems
Turkey's KAAN Combat Aircraft Completes First Flight - Mobility Engineering...
INSIDERMaterials
FAA Expands Boeing 737 Investigation to Manufacturing and Production Lines -...
INSIDERImaging
New Video Card Enables Supersonic Vision System for NASA's X-59 Demonstrator -...
INSIDERManned Systems
Stratolaunch Approaches Hypersonic Speed in First Powered TA-1 Test Flight -...
INSIDERUnmanned Systems
Army Ends Future Attack and Reconnaissance Helicopter Development Program -...
ArticlesEnergy
Can Solid-State Batteries Commercialize by 2030? - Mobility Engineering...
Webcasts
AR/AI
From Data to Decision: How AI Enhances Warfighter Readiness
Energy
April Battery & Electrification Summit
Manufacturing & Prototyping
Tech Update: 3D Printing for Transportation in 2024
Test & Measurement
Building an Automotive EMC Test Plan
Manufacturing & Prototyping
The Moon and Beyond from a Thermal Perspective
Software
Mastering Software Complexity in Automotive: Is Release Possible...