New Embedded Form Factor
Congatec AG (Deggendorf, Germany) and SECO (Arezzo, Italy) have jointly created a new form factor for embedded computing. The Qseven format will complement the low power and small size of next-generation embedded processors built using 45nm technology. The Qseven format offers high-performance computing power delivered in a board measuring just 70mm × 70mm
The new form factor has a maximum power consumption of around 12W specified in the standard. Where heat dissipation is an issue, a thermal cooling interface helps transfer any heat generated to a cooling solution. The platform will also provide extensive connectivity through industry standard interfaces, including: 4× PCI Express, 2× SATA, 6× USB 2.0, 1× 1000BaseT Ethernet, 2x SDIO 8 bit, LVDS 2× 24 Bit, DVO/SDVO (shared), VIP (Video Input Port), HDA (High Definition Audio), I2C Bus, and LPC (Low Pin Count Bus).
The form factor offers flexibility in configuration. By leveraging the Mobile PCI Express Module connector format, Qseven offers three different connector heights, from 4.3mm to 7.8mm. Typical applications will include automation and DIN rail systems, automotive, and anywhere an ultra mobile embedded computing system is required.
For Free Info, click here .
Top Stories
INSIDERManned Systems
Turkey's KAAN Combat Aircraft Completes First Flight - Mobility Engineering...
INSIDERMaterials
FAA Expands Boeing 737 Investigation to Manufacturing and Production Lines -...
INSIDERImaging
New Video Card Enables Supersonic Vision System for NASA's X-59 Demonstrator -...
INSIDERManned Systems
Stratolaunch Approaches Hypersonic Speed in First Powered TA-1 Test Flight -...
INSIDERUnmanned Systems
Army Ends Future Attack and Reconnaissance Helicopter Development Program -...
ArticlesEnergy
Can Solid-State Batteries Commercialize by 2030? - Mobility Engineering...
Webcasts
AR/AI
From Data to Decision: How AI Enhances Warfighter Readiness
Energy
April Battery & Electrification Summit
Manufacturing & Prototyping
Tech Update: 3D Printing for Transportation in 2024
Test & Measurement
Building an Automotive EMC Test Plan
Manufacturing & Prototyping
The Moon and Beyond from a Thermal Perspective
Software
Mastering Software Complexity in Automotive: Is Release Possible...