Master Bond’s (Hackensack, NJ) new Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness. It meets NASA low outgassing specifications and has superior durability and dimensional stability. It is formulated to cure at elevated temperatures between 250°F and 300°F for 1 hour, and produces exceptional bonds for service over the wide temperature range of 4K to 400°F. These tough bonds are remarkably resistant to severe thermal cycling and many chemicals, including water, oil and various fuels.

The hardened adhesive is a superb thermal conductor with a thermal conductivity of 9-10 BTU /in/ft2/hour/°F. Its Shore D hardness exceeds 75 and its compressive strength is greater than 15,000 psi. It is available for purchase in half pints, pints, quarts, gallons and 5 gallon containers.

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Embedded Technology Magazine

This article first appeared in the February, 2011 issue of Embedded Technology Magazine.

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