Ohmite Manufacturing (Arlington Heights, IL)recently introduced their high performance C40 Heatsink System with modular cooling benefits. Designed to provide engineers with a variety of cooling options, the C40 heatsinks feature flexible board mounted modular assembly that can be used in conjunction with up to four TO-247 and TO-264 power resistors, or similarly packaged passive and active components. These 58mm heatsinks can be used individually or in compact paired configurations. Patented camming clips (sold separately) easily secure the devices in place without the need for holes or screws. In order to create active cooling and enhance their thermal capacity in back-to-back paired operations, the C40 heatsinks include pre- configured mounting holes to accommodate a standard 40mm x 40mm fan.

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Embedded Technology Magazine

This article first appeared in the June, 2013 issue of Embedded Technology Magazine.

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