Molex Incorporated (Lisle, IL) has announced a high-performance connector system designed specifically to enable PCB developers in the video, commercial broadcast and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints. The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design, which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility. The modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts. The DIN 1.0/2.3 interface allows up to 1.00 mm of axial engagement tolerance.

Click here to learn more.  


Embedded Technology Magazine

This article first appeared in the June, 2013 issue of Embedded Technology Magazine.

Read more articles from this issue here.

Read more articles from the archives here.