Uninterruptible Power Supply

The Rugged Half Rack UPS™

Acumentrics (Walpole, MA) introduced their 1000W Rugged Half Rack UPS™ (Uninterruptible Power Supply) with industry leading SWaP-C. At just 12 lbs, Acumentrics’ Rugged Half Rack™ UPS features a power density of 83W per pound and is just one-third the size of a 1000W full-size chassis. This Mil Standard Certified UPS provides systems architects with a COTS (Commercial Off The Shelf) power system that can be easily integrated with Small Form Factor Modules from: DTECH; KLAS; PACSTAR; Mercury; HP; and Dell, along with other computer networking and communication modules that require 20 VDC to 30 VDC mission-critical power. It is also compatible with small form factor transit cases that are available from Ameripack, ECS, Desapro and others.

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Single Board Computer

The PX1-C441

WINSYSTEMS (Grand Prairie, TX) announced its latest PCIe/104 OneBank single board computer, which enables cybersecurity and root-of-trust functionality through its onboard hardware Trusted Platform Module (TPM-2.0-compliant) security device. The PX1-C441 also offers improved memory access via its soldered LPDDR4 RAM—up to 8 GB—and delivers better thermal performance at extended temperatures. WINSYSTEMS’ PX1-C441 single board computer with improved cyber security hardware is founded on the powerful Intel® Atom™ E3900 processor, available as dual- or quad-core. It features Intel®-Time-Coordinated Computing Tools for latency-sensitive real-time applications and IEEE 1588 Precision Time Protocol (PTP). And, it supports an operating temperature range of -40°C to +85°C.

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FPGA Development Platform

The XEM8320-AU25P

Opal Kelly (Portland, OR) announced the XEM8320-AU25P, the official development platform for the Xilinx Artix UltraScale+ FPGA. The new platform features Opal Kelly’s FrontPanel® SDK for building high-performance, software-connected FPGA applications. The XEM8320-AU25P also leverages the versatile SYZYGY® modular connectivity for rapid prototyping and expansion. The XEM8320-AU25P features the Xilinx Artix UltraScale+ XCAU25P-2FFVB676E FPGA and USB 3.0 Type C SuperSpeed interface. The platform also includes 11 high-speed gigabit transceiver lanes via Artix UltraScale+ transceivers. Artix UltraScale+ transceivers support serial standards such as 10 GbE, JESD-204B, DisplayPort, PCI Express, SATA, HD-SDI, XAUI, and Aurora.

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Robot Additive DED Programming

Additive DED is a series of metal 3D printing technologies that creates parts by melting and fusing material as it is deposited.

ESPRIT (Camarillo, CA) recently announced a partnership with Alma, a CAD/CAM provider for robotics, to create a complete programming solution for robot additive DED (direct energy deposition). Additive DED is a series of metal 3D printing technologies that creates parts by melting and fusing material as it is deposited. Wire arc additive manufacturing (WAAM), also known as DED-arc, is one of the additive DED technologies being applied in robot additive DED to produce the near net shape preforms with significant cost and lead time reductions, increased material efficiency, and improved component performance. This solution allows Alma to use the full ESPRIT additive DED cycles such as 3×, 4×, and 5×. The solution also allows ESPRIT to support industrial robot brands including Yaskawa, ABB, Fanuc, Kuka, and others.

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3U VPX FPGA Modules

The Model 5585 and Model 5586

Mercury Systems, Inc. (Andover, MA) announced the Model 5585 and Model 5586 SOSA aligned Xilinx Virtex UltraScale+™ high-bandwidth memory (HBM) FPGA 3U VPX modules. These are the first open architecture 3U products on the market to feature HBM (memory directly integrated on the FPGA chip), offering a 20× increase in memory bandwidth over traditional DDR4 memory. This design dramatically boosts signal processing speeds to support size, weight and power (SWaP)-constrained compute-intensive applications such as electronic warfare, radar, signals intelligence and big data. Navigator Design Suite accelerates design with tools that enable complete operational control of the hardware and all IP functions in the FPGA. Dual 100 GigE interfaces.

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Milling Tool

The CoroMill ® MH20

Sandvik Coromant (Sandviken, Sweden) has launched a new high-feed milling tool. The CoroMill ® MH20 is primarily designed for milling cavities, or pockets, in ISO S, M and P materials. Ensuring secure and vibration-free machining, especially at long overhangs, the CoroMill® MH20 delivers edge security for a variety of industries and is particularly suited to machining aerospace components. The tool’s ability to machine at long overhangs makes it especially beneficial for the aerospace sector. This method is an important requirement when machining deep, narrow pockets to produce the components that form an aircraft’s frame, such as the supporting beams found within the sub-segment aerospace frame. These beams are often machined from forged titanium.

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Modulating Control Valves

Valcor can design the modulating control valve (MCV),

Valcor Engineering Corporation (Springfield, NJ) is now offering a line of modulating control valves. Modulating control valves (MCV), also known as proportional control valves (PCV), perform proportional flow control in avionics cooling systems, pneumatic and hydraulic systems. They are also suitable for controlling aviation fuel flow and Polyalphaolefin (PAO) control. MCVs are often used to replace a traditional pulse-width-modulated solenoid valve for flow control. It can be used in fully open or closed position, but its real value in a fluid control system is that it can be modulated anywhere in between. With a closed-loop feedback control scheme, this allows for very accurate and precise proportional flow control. Valcor can design the MCV to fail closed or open, fail in last position, or fail to a specified flow between open and closed.

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Radiation-Hardened Power Converters

A new set of SA50-120 power converters

Microchip Technology Inc. (Chandler, AZ) announced the expansion of its SA50-120 power converter family with nine new units based on its Commercial Off-the-Shelf (COTS) technology. Microchip’s SA50-120 radiation-hardened DC to DC power converters utilize surface mount component construction, and are qualified to Mil-Std-461, Mil-Std-883 and Mil-Std-202. The units are qualified to 100 krad (Si) Total Ionization Dose (TID) and Single Event Effects (SEE) greater than 80 MeV cm2/mg, and offer synchronization, a Transistor-Transistor Logic (TTL) on/off command signal, and various protection features. Microchip’s SA50-120S units are available in 3.3V, 5V, 12V, 15V and 28V outputs. SA50-120T units are available in 3.3V or 5V main output with 12V or 15V auxiliary outputs.

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Fanless Embedded System

The Rudi-AGX

With an AGX Xavier SoM embedded, Rudi-AGX from Connect Tech (Ontario, Canada) features a Volta GPU with 512 CUDA® cores, 64 Tensor Cores, and is able to achieve an AI performance of 32 TOPs. Not all AGX Xavier systems are built the same. Rudi-AGX’s thermal optimization allows access to the module’s full AI performance capabilities, making it the AI Edge solution compute-intensive applications rely on. Designed to accommodate sensor-heavy applications, Rudi-AGX provides the ability to directly connect eight GMSL cameras, expand storage with NVMe or an SD card, and utilize a video capture card. Connectivity includes WiFi, Bluetooth, and LTE slots, as well as two GbE ports available. This edge device also comes equipped with 6× GPIO, 4× USB 3.0, 2× UART, 2× I2C, 2× SPI, and an RS-485 connector.

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Digital Oscilloscope

A StationMax Digital Oscilloscope

RIGOL Technologies (Beaverton, OR) announced its next generation of technological innovation with the release of StationMax Digital Oscilloscopes powered by the new UltraVision III platform. The new DS70000 Series is available in either 3 or 5 GHz bandwidths and combines the new UltraVision III oscilloscope technology and UltraReal spectrum analysis. The UltraVision III platform combines updated oscilloscope and spectrum analysis technology with its custom front-end Phoenix ASIC chipset to expand RIGOL solutions into new applications. In addition to 3 or 5 GHz bandwidths, StationMax provides 4 channels, 20 GSamples/sec sample rate (10 GSa/sec on all channels), 1 million waveforms/ sec capture rate, 2 Gpts maximum storage depth, and high-resolution measurements up to 16 bits.

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COM-HPC Carrier Board Design Guide

PICMG released the COM-HPC Carrier Board Design Guide.

PICMG (Westfield, MA), a leading consortium for developing open embedded computing specifications, released the COM-HPC Carrier Board Design Guide and it is freely available on the PICMG website. The 160-page document provides electronics engineers and PCB layout engineers comprehensive information for designing custom system carrier boards for COM-HPC modules. COM-HPC – short for computer-on-module (COM) - high performance computing (HPC) – is a brand new open Computer-on-Module form factor standard that targets extremely high I/O and computer performance levels from high-end clients up to the entry server class and even beyond. Standard COM-HPC modules plug into a carrier or baseboard that is typically customized to the application.

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Thermoelectric Coolers

The PowerCycling PCX Series

Thermal Cycling devices used for Real-Time PCR utilize thermoelectric technology to precisely manage temperature set points and ramp rates, enabling amplification of DNA segments. To improve temperature precision control in PCR devices, Laird Thermal Systems (Morrisville, NC) has developed an elongated series of PowerCycling PCX thermoelectric coolers. Utilizing proprietary processes and a unique module construction, the PCX Elongated Series provides high reliability and a minimal temperature gradient for PCR applications resulting in greater throughput and faster test results. The PowerCycling PCX Series features a unique robust construction with a thermally conductive “soft layer” that absorbs the mechanically induced stresses caused by thermal cycling applications.

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USB-C Charge/Sync Hub

The Cambrionix ThunderSync3-C10 Charge/Sync Hub

Saelig Company Inc. (Fairport, NY) has introduced the Cambrionix ThunderSync3-C10 Charge/Sync Hub, a Thunderbolt-certified hub that features 10 × USB Type-C connectors and offers 3 Amp (15W) charging and USB 3.2 Gen 1 data for each connected device. Offering up to a 10x speed boost over its predecessor, the ThunderSync3-16, the ThunderSync3-C10 suits data intensive situations and comes with Cambrionix’s signature LiveViewer software for fast, reliable, and scalable control across multiple devices. Dual Thunderbolt 3 ports offer a 40 Gbit/s upstream data pipe and daisy-chain port with each high-speed port able to transfer data at up to 5 Gbit/s. Up to 6 × Thundersync3 C10 hubs can be connected to a single host computer to allow management of up to 60 USB devices. RGB LEDs are provided on each port for status feedback. The ThunderSync3-C10 is supplied in a sturdy, compact (17 × 10.3 × 1.7" / 431 × 262 × 43.6 mm) and lightweight (1.1 lb / 0.5 kg) UL94-V0 specification fire enclosure.

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