Electrically Conductive Gaskets

Stockwell Elastomerics, Inc. (Philadelphia, PA) announced EMI shielding gaskets and sheet materials produced with nickel-coated aluminum particles for long-term shielding effectiveness and galvanic protection of electrical housings installed in harsh environments. Die cut gaskets or waterjet cut gaskets are available from .020" thick to .125" thick, and compression molded gaskets are available custom-molded from uncured compound. Two compounds are initially available. SNA-568 nickel-aluminum filled silicone is 68 durometer Shore A and will perform in most applications that need long-term EMI shielding and galvanic corrosion resistance. SNAF-572 nickel-aluminum filled fluorosilicone is 72 durometer Shore A. Fluorosilicone rubber provides enhanced resistance to swelling and deterioration when in contact with oils, fuels and fluids used in aviation.

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Explosive Atmosphere Test Bench

Emitech Group’s (Vendargues, France) new bench is designed for carrying out tests in an explosive atmosphere. These tests specify the requirements and procedures for aircraft equipment which could come into contact with flammable fluids and vapors. The test bench has been designed to the following specifications: the chamber volume is 450 dm3, absolute pressure conditions up to 12,200 meters (40,000 feet) in altitude, temperatures up to 120°C (248°F). Sealed passages are available in the walls of the test chamber to accommodate controls or supply to the equipment under test, for example electrical controls, fluid supply or mechanical activation. The tests performed by Lefae comply with the requirements of EUROCAT-ED-14D, RTCA DO-160, MIL-STD-810 standards.

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Gen 3 RFSoC Solutions

Pentek, Inc. (Upper Saddle River, NJ) announced extensions to their Quartz® RFSoC product family by introducing the QuartzXM eXpress Module, the Model 6003, adding greater RF performance and scalability. The QuartzXM Model 6003, based on the Xilinx Zynq® UltraScale+™ RFSoC Gen 3, provides full sub-6 GHz direct-RF I/O support and greater flexibility with more decimation and interpolation options. It is ideal for 5G and LTE wireless, SIGINT, EW, communications and radar applications in SWaP-critical environments. These new Quartz products support direct RF sampling using 5 GS/sec 14-bit ADCs and eight 10 GS/sec 14-bit DACs, both supporting analog signals up to 6 GHz. Each data converter has built-in digital downconverters or upconverters with programmable decimation and interpolation up to 40×.

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AI and Computer Vision Software

Core Avionics & Industrial Inc. (CoreAVI) (Tampa, FL) announced the release of their Safe AI and Computer Vision Solution including its newest product, VkCoreVX™ SC, a safety critical implementation of Khronos’ OpenVX™1.3 API. CoreAVI’s Safe AI and Computer Vision Solution provides a flexible framework for computer vision, signal processing, and neural network inferencing while achieving stringent levels of safety certification. In addition to the VkCore SC graphics and compute driver, the complete Safe AI and Computer Vision Solution also includes CoreAVI’s ComputeCore™ compute libraries to enable safety critical implementation of BLAS (Basic Linear Algebra Subprograms) and FFTs (Fast Fourier Transform).

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Data Storage System

Curtiss-Wright’s Defense Solutions division (Ashburn, VA) announced the expansion of its family of solutions for unattended protection of data-at-rest (DAR) with the introduction of the new UNS Ground Station (UNS-GS) network attached storage (NAS) system. The UNS-GS provides a ground-based complement to its popular deployable Unattended Network Storage (UNS) system. Both solutions support NSA Certified Type 1 encryption for DAR using the General Dynamics Mission Systems (GDMS) ProtecD@R® Multi-Platform Encryptor (KG-204). Classified data (up to 32 TB) is stored on Removable Storage Modules (RSM), which are used to transport data between the ground-based UNS-GS and deployed UNS. The UNS-GS captures data via industry standard network storage protocols (NFS, CIFS, iSCSI, HTTP, and FTP) through four 10 Gigabit Ethernet GbE at speeds up to 2 GB/s.

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Hydraulic Aircraft Sealing Systems

Trelleborg Sealing Solutions Aerospace (Stockholm, Sweden) launched the Turcon® VL Seal® II for hydraulic sealing of actuators in flight controls and landing gear, and seals in landing gear shock absorbers. Based on the original Turcon® VL Seal®, this new generation seal offers enhanced sealing efficiency, easier installation, and even greater reliability. Compared to the Turcon® VL Seal®, the Turcon® VL Seal® II back-pumping performance more than doubled up to 3,000 psi and nearly doubled at pressures up to 5,000 psi. Accumulative leakage was around 4 milliliters less and significantly lower (around a half) from 1,000,000 to 2,000,000 cycles. Turcon® VL Seal® II is a unidirectional rod seal for reciprocating movements, consisting of an “L” shaped Turcon® jacket energized by an o-ring. ‘Sealed for life’ means the seal lasts as long as the actuator itself.

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OpenVPX Chassis and Backplanes

To speed delivery and reduce cost, Annapolis Micro Systems (Annapolis, MD) is now manufacturing a variety of ‘Quick-Turn’ WILD100™ 3U and 6U OpenVPX Chassis and Backplanes (WCG000) that are both SOSA™-aligned and 40/100Gb Ethernet capable. The front-loading air-cooled chassis feature up to 16 conduction-cooled slots. Accompanying 100GbE WILD100 Backplanes utilize SOSA-aligned payload and switch profiles. Payload slots include optional VITA 66.5C and VITA 67.3C connectivity. Line rates of 25 Gbps on data and expansion planes are via 25/40/100Gb Ethernet, SDR/DDR/QDR/EDR InfiniBand, Gen 3/4 PCI Express, and/or custom protocols.

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Electrically Conductive Elastomers

Materials enhancements in two new electrically conductive elastomers from Laird Performance Materials (Santa Clara, CA) eliminate the risk of galvanic corrosion and damage from fuel, oils and deicing fluids in military and aerospace applications. EcE 130 is an electrically conductive fluorosilicone elastomer featuring conductive passivated silver aluminum filler that offers high surface conductivity, eliminating energy leakage and reducing signal interference. EcE 135 is an electrically conductive fluorosilicone elastomer featuring nickel aluminum filler. The nickel’s inert properties are compatible with all other metals, offering better corrosion resistance than other filler materials.

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Drone Detection Software

Citadel Defense (San Diego, CA) has pushed a new AI and machine learning software release to Titan systems deployed across thirteen countries. Citadel’s AI and machine learning software has evolved over 27 months of successful deployments across multiple combat commands and hundreds of unique environments. Citadel can quickly and cost-effectively extend protection against emerging foreign-built drones, like those used in recent attacks on Armenia and the Middle East, that evade legacy counter drone systems. Citadel’s radio frequency sensors bring advanced AI and machine learning detection performance to integrated layered counter drone solutions. The system’s open architecture allows for quick integration with other sensors, offering a suite of options that match any mission need or configuration.

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MIL-SPEC-Qualified Connector Covers

TE Connectivity (TE) (Harrisburg, PA) introduced its new DEUTSCH 38999 series IV metal protective connector covers. TE’s metal protective connector covers are designed to help protect connectors in their unmated condition from debris and fluids like rain, sand, jet fuels, hydraulic fluids, dust and other substances. Available in five plating configurations and eight shell sizes, these covers offer a rugged, lightweight way of creating environmentally sealed conditions for the connector. TE’s DEUTSCH 38999 series IV metal protective connector covers are qualified to MIL-DTL-38999 Series IV, D38999/51 and D38999/52 slash sheets. They are designed for military and commercial avionics systems, ground vehicles, radar systems and missile launch platforms, among other applications.

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SOSA Aligned Backplanes

As The Open Group® Sensor Open Standards Architecture™ (SOSA™) initiative continues to move towards completion, Elma Electronic Inc. (Fremont, CA) has added two 3U backplanes to its growing family of products aligned to Snapshot 3 of the SOSA Technical Standard. Available populated with or without VITA 67.3 connectors for timing and RF connectivity, the 6-slot and 8-slot backplanes provide the foundation for complex, high speed signal processing systems. The backplanes incorporate the latest for precision network timing plus slot profiles for SBCs, switches, radial clocks and expansion. All data paths support high-speed signals. Either used as configured or customized to meet specific system needs, the SOSA aligned backplanes enable a wide range of slot counts and connection configurations and follow the DoD’s convergence initiative as laid out in the Modular Opens Systems Approach (MOSA) mandate.

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High-Performance FPGA

Microchip Technology (Chandler, AZ) announced that its RTG4 Field Programmable Gate Array (FPGA) family is the first in a Ceramic Quad Flat Pack (CQFP) option to achieve qualification to the industry’s Qualified Manufacturers List (QML). Microchip’s CQFP package with 352 pins for RTG4 FPGAs simplifies system design in applications ranging from satellites and space probes to planet landers and vehicles. RTG4 FPGAs give space systems high-speed signal-processing capabilities and leverage reprogrammable flash memory to provide greater immunity to configuration Single Event Upsets (SEUs) while consuming 40 to 50 percent less power than static random access memory (SRAM) FPGAs. RTG4 FPGAs feature 150,000 logic elements (LEs), 462 multipliers and 5.2 megabits (Mb) of memory.

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8-Channel Universal Thermocouple Amplifier

Harold G. Schaevitz Industries LLC (HGSI) (Bloomfield Hills, MI) has expanded its sensor products by offering a new 8-Channel Universal Thermocouple Amplifier Signal Conditioner Module with both digital and analog outputs. Made in the USA, this compact, lightweight 8-channel universal thermocouple amplifier module supports thermocouple types J, K, T, E, N, R, S and B, and is suitable for most temperature measurement applications. With user programable minimum & maximum temperature spans, this amplifier is designed for simple integration to aftermarket ECUs, data loggers, or other electronic devices, requiring a linear 0 to 5 VDC input. Features include: 8 independent 0 to 5 VDC analog outputs; digital interfaces for USB, CAN, and RS232; internal cold junction compensation; and downloadable programming software.

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Two-Slot 6U VPX Rackmount Chassis

VadaTech (Henderson, NV) recently announced the VTX995, a dual slot 6U VPX chassis supporting up to two conduction cooled 6U VPX modules. The chassis accepts both front and Rear Transition Modules (RTM). The chassis CPU will monitor and maintain temperature at the VPX module wedge, as set by the user, allowing testing of conduction cooled modules in a standard development environment without use of a thermal chamber. The chassis has provision to mount to a 19" rack. The VTX995 Universal AC power supply provides 400W to the chassis. The chassis supplies all the necessary power (+12V, -12V, +5V, etc.) to the module and RTM in accordance with VITA 46 specifications and has a battery pack included to provide VBAT. The chassis is cooled by variable speed fans controlled by an on-board CPU, keeping each wedgelock at the user defined temperature.

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Computer-on-Modules

congatec (Deggendorf, Germany) introduced six new computer-on-modules with 11th Gen Intel Core processors for the extended temperature range. Built with components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments. Based on the new low-power high-density Tiger Lake SoCs, the new modules offer up to 4 cores, 8 threads and up to 96 graphics execution units for massive parallel processing throughput in an ultra-rugged shape. The integrated graphics can be used as parallel processing units for convolutional neural networks (CNN) or as an AI and deep learning accelerator.

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Graphics Output Card

Abaco Systems (Huntsville, AL) announced the newest addition to its line of NVIDIA Turing™ architecture chip-down GPU family of products with the GRA115Q 3U VPX Graphics Output card. The GRA115Q is available with your choice of an NVIDIA Quadro RTX™ 5000 or Quadro RTX™ 3000 GPU. At peak performance, the Quadro RTX™ 5000 provides up to 9.49 TFLOPS of single precision floating point compute performance (FP32). The Quadro RTX™ 5000 facilitates up to 448 GB/s memory bandwidth with its 256-bit wide, 16 GB GDDR6 graphics memory for data intensive applications. The GRA115Q features three output configuration options: Dual Display Port 1.4a + Dual SL-DVI outputs; Quad SL-DVI outputs; and Quad DisplayPort 1.4a at 4K @ 60Hz.

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OpenVPX Chassis Manager

Pixus Technologies (Waterloo, Ontario) now offers a conduction-cooled model for their 3U OpenVPX Chassis Manager. Compliant to the VITA 46.11 specification for system management and to VITA 48.2 for mechanical design, the Tier 2 Pixus OpenVPX Chassis Manager monitors at least 6 temperature sensors and 10 fans with custom options available. There is fan PWM/Tach control, along with 16 digital inputs and outputs. A Level-2 unmanaged 3- port Ethernet hub is also optional. The standard panel interface has RS-232, RJ-45, USB and LEDs. The Pixus SHM200 features a web interface to remotely query the system and the user can import images of their boards. By clicking on the image for each slot, the user can drill down to the monitored status of the module.

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CAD/CAM Software Suite

OPEN MIND Technologies AG (Needham, MA), a developer of CAD/CAM software solutions, has introduced its latest hyperMILL®2021.1 CAD/CAM software suite that offers users new and enhanced features for efficient 3D, 5-axis and mill/turn machining. Key innovations include a new “Interactive Edit Toolpath” capability that enables toolpath editing after initial toolpath generation. Especially productive for optimizing tool and mold making, the new toolpath editing feature is easy-to-use and offers programmers the flexibility to adapt toolpaths by trimming and removing sequences accordingly for component conditions. To streamline access to product manufacturing information (PMI) and metadata, hyperMILL® 2021.1 offers a new import function that retrieves face quality information and metadata when importing CAD data from neutral or native formats and attaches data to the imported faces in hyperCAD®-S, making the information available to hyperMILL® and its machining processes.

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Digital Eighth-Brick DC/DC Converters

Flex Power Modules (San Jose, CA) announced the launch of the BMR492 – a series of digital eighth-brick intermediate bus converters capable of delivering between 600 to 800W of continuous power along with a peak power of up to 1100W for short periods <1s. This so-called ‘burst mode’ operation is commonly required for CPUs (such as Intel’s Ice Lake processor for example) for datacom and data center applications. The new BMR4920302/861 converter, the first of three variants of the BMR492 family to be introduced, delivers a 12V output. Rated to a maximum 600W output over an input voltage range of between 40-60V, the DC/DC step-down solution is suitable for nominal 48 or 54 V input voltage systems commonly found in data center server applications. The through-hole mounted device is fully regulated and includes an input to isolation voltage of 1500 VDC.

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Aerospace & Defense Technology Magazine

This article first appeared in the April, 2021 issue of Aerospace & Defense Technology Magazine.

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