Multiphysics Modeling Software

COMSOL (Burlington, MA) has released version 5.6 of the COMSOL Multiphysics® software. The new version features faster and more memory-lean solvers for multicore and cluster computations, more efficient CAD assembly handling, and application layout templates. A range of new graphics features — including clip planes, realistic material rendering, and partial transparency — offer enhanced visualization for simulation results. Four new products expand the capabilities of COMSOL Multiphysics for modeling fuel cells and electrolyzers, polymer flow, control systems, and high-accuracy fluid models.

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FiberOptic, Electronic Adhesive

epoxySet (Woonsocket, RI) introduced the EPOXI-BOND™ EB-153, high-temperature epoxy. Originally developed for fiber optic cable assembly, this heat cure epoxy is a choice product for electronic bonding applications, as well as for sealing and coating requirements. This two-part system can be cured as quickly as one minute @ 150°C. It has a low-medium viscosity with a 5-6 hour work time at room temperature. The high-technology formulation includes a cure indicator that changes color from clear yellow (uncured) to dark red (cured). Once cured, this epoxy produces a glass transition temperature of 115°C and can be used up to 250°C continuously.

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Warfighter LWIR Cameras

Capable of identifying both manmade and natural materials, Polaris Sensor Technologies (Huntsville, AL) developed the Pyxis hybrid polarizing IR camera for target detection and search-and-rescue operations. Small enough and light enough to be either helmet-mounted or UAV-mounted, the Pyxis can detect a wide variety of man-made materials including metals, plastics, oils, and many others. Detecting both polarization data and thermal imagery data and fusing them together into a single image, the Pyxis provides superior detection capability for IED detections, target detection, search and rescue, and other applications that require detection capability.

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Solid-State Drive

Mercury Systems Inc. (Andover, MA) introduced the MissionPak™ SLC ultra-portable secure solid-state drive (SSD) for mission-critical applications requiring reliability, security and ruggedization. Optimized for applications such as command, control, communications, computers and intelligence (C4I) and avionics, MissionPak SSDs use AES-256 XTS encryption, have the latest generation of NAND flash technology and are packaged into compact, water-resistant, self-destructing form factors for secure use in harsh environments. Able to clear themselves in less than 10 seconds to protect data, the MissionPak SSDs are available in 128 GB or 256 GB storage configurations, weigh only 80 grams (approximately 0.18 pounds) and fit in the palm of the hand.

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OpenVPX Backplanes

Pixus Technologies (Waterloo, Ontario) has announced new OpenVPX backplanes designed for horizontal-mount enclosures. The horizontal-mount backplanes can be placed into 1U-4U tall 19” rackmount OpenVPX enclosures and provide enough space to have three 3U slots or one 3U and one 6U slot side-by-side, meaning a wide range of configurations and size options are available. The backplanes are typically designed to support at least PCIe Gen3 speeds, but higher-speed options are offered. Versions that accommodate VITA 66 (for optical) or VITA 67 (for RF) through the backplane and SOSA requirements are also optional.

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Pulsed Driver Amplifier

Empower RF (Inglewood, CA) announced the release of their Model 2239 pulsed driver amplifier producing a minimum of 1KW peak power. The 2239 is an intelligent amplifier in a compact 3U rack compatible footprint with features ideal for integrating into Magnetron, IOT, Klystron and TWT systems. The amplifier is designed for 0-dbm input that is pulse modulated. A fast TTL gate input is standard, and its use optional when complete shutoff of the output stage is desired between pulses. Pulse capabilities include up to 20% duty cycles and pulse widths as long as 500 μsec with up to 25 KHz PRF’s. GaN on SiC devices are used in a multistage class AB configuration.

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Gigabit Ethernet Switch Modules

Diamond Systems (Sunnyvale, CA) has unveiled the latest model in its popular line of compact gigabit Ethernet switch modules. The EPSM-10GX4 managed switch offers 24 10/100/1000Mbps copper ports + 4 10Gbps SFI ports and Layer 2+ switching and Layer 3 routing/switching software in the ultra-compact size of 2.2” × 3.3” (55 mm × 84 mm). The module is intended to be used on a carrier board, such as Diamond's EPS-24G4X, to implement a complete Ethernet switching solution. EPSM-10GX4 is designed to meet the challenges of vehicle environments with its 50% thicker PCB, - 40/+85°C operating temperature range, and MIL-STD-202G shock/vibration resistance.

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Fire-Retardant Graphite Additive

NeoGraf Solutions (Lakewood, OH) recently announced the addition of GrafGuard® 280-50N to its lineup of expandable graphite flake, non-halogenated, non-flammable, fire-retardant additives. The new GrafGuard 280-50N is specifically targeted toward the thermoplastics industry, especially specialty polymers with high processing temperatures including composites and multi-functional systems with high melting points for both injection molded and thermo-formed applications. With a particle size of 50 mesh or 300 microns, Graf-Guard 280-50N has an on-set temperature of 280°C (536°F). There is no reaction below 280°C (536°F) with no volatile loss and no visible puffing.

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RF Circulators/Isolators

Fairview Microwave Inc. (Irvine, CA), an Infinite Electronics brand, has extended its selection of high-performance circulators/isolators for 5G telecommunication, satellite communication, automotive radars, aerospace applications and point-to-point radios.

Fairview Microwave's expanded line of RF circulators/isolators includes 75 models that cover operating frequency ranges up to 42.5 GHz. These circulators/isolators boast a maximum power rating of up to 100 Watts and are offered in SMA, N-type, 2.4 mm and 2.92 mm connectorized designs.

Dual junction and single junction versions are available.

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Directional Coupler

KRYTAR, Inc., (Sunnyvale, CA) announced a new directional coupler operating in the frequency range of 0.5 to 8.0 GHz offering Nominal Coupling (with respect to output) of 30 dB, ±0.8 dB in a compact package. KRYTAR’s Model 158030 also offers frequency sensitivity of ±0.6 dB. The directional coupler exhibits insertion loss (including coupled power) of less than 0.80 dB, directivity of greater than 16 dB, maximum VSWR (any port) is 1.35, input power rating is 20W average and 3 kW peak. The compact package measures 5.25 inches (L) × 0.53 inches (W) × 0.72 inches (H), and weighs only 3.8 ounces. Operating temperature is -54° to +85° C.

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Process Simulation Software

Desktop Metal (Boston, MA) recently launched Live Sinter™, a software solution designed to eliminate the trial and error required to achieve high-accuracy parts via powder metallurgy-based additive manufacturing processes like binder jetting. Live Sinter not only corrects for the shrinkage and distortion parts typically experience during sintering, but also opens the door to printing geometries that, without the software, would present significant challenges to sinter. While compatible with any sintering-based powder metallurgy process, including metal injection molding (MIM), Live Sinter will first be available to customers of Desktop Metal’s Shop System™ and Production System™.

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Adaptive Computing Acceleration Platform

Alpha Data (Golden, CO) released the ADM-PA100, the first deployable adaptive computing acceleration platform (ACAP)-based data processing unit suitable for PCIe deployment. The ADM-PA100 is based around the Versal AI Core series, which includes an array of Xilinx AI Engines (dedicated VLIW processors, capable of Vector Math Processing at compute densities 5x higher than programmable logic). The Xilinx Versal series of devices also feature an on-chip Programmable NoC, dedicated hardened IP for Multi-Rate 100G Ethernet, hardened PCIe Gen4 endpoints with DMA outside the programmable logic, hardened DDR4 memory controllers, built-in ARM A72 and R5F CPUs, and programmable logic and DSP performance a generation on from UltraScale+ devices.

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High-Density 1U Server

With four double-width cards per rack unit, the TeraBox 1400B from BittWare (Concord, NH) has twice the density of a 4U/8-card server, plus a better CPU-to-card ratio of 2:1 versus 4:1 (for dual-socket servers). Choice of FPGA card includes the XUP-VV8 (Xilinx UltraScale+ VU13P), 520N-MX(Intel Stratix 10 MX with HBM2), and S7t-VG6 (Achronix Speedster7t). The custom-designed server features four full-size FPGA cards in a 1U chassis with front-panel access. The motherboard supports two Intel Xeon Scalable processors with 12× DIMMs per CPU, dual redundant power supplies, and enterprise-class build quality for datacenter deployment throughout. Using the XUP-VV8 you can have up to 32× 100G links or 128× 10/25G links (using breakout cables) from the front panel.

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Fluid Cell Sheet Hydroforming Press

Beckwood Press Company (St. Louis, MO) recently delivered a Triform model 68- 10FC Fluid Cell Sheet Hydroforming Press to a major supplier of space launch vehicles. This machine features a 68-in. diameter round forming area that can hold one large tool or multiple smaller tools simultaneously. Once the tooling and blank are loaded, they are transported into the press via an automated hydraulic shuttle system. The operator then sets the optimal forming pressures (up to 10,000 psi) and the desired dwell times, if any. Operators can program up to 10 individual steps, selecting the desired pressure and dwell time for each. Up to 500 recipes can be stored in the HMI for easy recall. During the cycle, a pressurized rubber diaphragm acts as a universal die half, applying equal pressure over every square inch of the part’s surface.

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AC Power Source

Highland Technology (San Francisco, CA) has introduced the P900, a 3-phase AC power source and alternator simulator. It can simulate aircraft power busses and PMA permanent-magnet alternators and drive FADEC shunt regulators. Each phase can output 0 to 160 VRMS at 200 VA and 120 Hz to 4 kHz, including applications requiring a 400 Hz or APU/wild power source. Outputs can be programmed as low-impedance voltage busses or alternators with controlled source impedances. Features include output measurements, waveform monitors, and fault simulation. Control interfaces are USB and Ethernet. The P900 is packaged in a 3U aluminum rackmount enclosure and operates from single-phase AC power.

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RISC-V Enabled SoM

Sundance (Chesham, UK) has launched PolarBerry, the first production and deployment-ready SoM with a hardened 64 bit, multicore real-time, Linux-capable RISC-V MPU subsystem to deliver an unparalleled combination of defense-grade security, low power consumption and thermal efficiency for embedded systems development. With Microchip Technology Inc.’s PolarFire SoC field programmable gate array (FPGA) at its heart, providing a deterministic, coherent 64-bit RISC-V CPU cluster and a deterministic L2 memory subsystem enabling the implementation of secure Linux and real-time applications, PolarBerry is suited to the development of embedded computing and real-time applications based on RISC-V processors as an alternative to ARM.

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Aerospace & Defense Technology Magazine

This article first appeared in the February, 2021 issue of Aerospace & Defense Technology Magazine.

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