Aircraft Simulation Systems

Bloomy Controls, Inc. (Windsor, CT) recently announced three new simulation systems for HIL test of electronic control systems, along with the Bloomy Simulation Reference System. The Bloomy FADEC/EEC Test Platform, the Bloomy Flight Control System Test Platform and the Bloomy Environmental Control Test Platform are built on the Bloomy Simulation Reference System and use commercial-off-the-shelf (COTS) technology to accelerate open- and closed-loop test for these applications.

A key element of the Bloomy Simulation Reference System is NI Switch, Load and Signal Conditioning (SLSC), which offers the following benefits to design and test engineers: common cable connectors that reduce custom cable assemblies and point-to-point wiring; fault insertion built into the architecture and available on every analog simulation channel; ability to breakout and probe every channel using Bloomy ThroughPoint panels; built-in self-test for rapid verification of system integrity; and use of COTS components for shorter lead times when deploying new or updated systems.

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VPX Open Frame Development Chassis

LCR Embedded Systems (Norristown, PA) has released two new VPX Development and Evaluation Chassis for 3U and 6U systems. The DK3 and DK6 feature enhanced flexibility, fast conversion between air and conduction cooled module support, as well as fast backplane replacement. Two base versions are available for development of either 3U or 6U modules.

Standard configurations may include power and ground backplanes, or application specific VPX or SOSA-aligned versions with up to 12 slots, depending on pitch requirements. Combinations of air and conduction cooled card guides and power supplies to support a range of module types and power requirements are also available. All LCR development systems can be configured with VPX, VME, cPCI or cPCI Serial backplanes.

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OpenVPX Development Chassis

Pixus Technologies (Waterloo, Ontario) has announced a new version of the VPXD1000 series that allows various VITA 67 slot configurations for RF interfaces over OpenVPX. The chassis can be partitioned for a separate segment for specialty RF devices or for SOSA (Sensor Open Systems Architecture) implementation.

The new version of the VPXD1000 comes in a 63HP (12.6'') wide size, allowing higher slot count backplanes up to ten slots at a 1.0'' pitch. Alternatively, designers can utilize one portion of the chassis for a smaller VITA 67 backplane over OpenVPX and a separate segment for RF or other devices. Pixus can optimize the airflow/cooling for each segment to best suit customer requirements.

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Rugged Computer

Equipto Electronics’ (Aurora, IL) new TEMPEST PC concept allows customers to choose an up-to-date ATX motherboard, or an HP or Dell i7 PC repackaged for the ultimate in secure operation. The system delivered will be certified to the strictest standard in the industry for devices operating in NATO Zone 0 environment, the NATO SDIP-27 Level A.

Each system is fully customizable and typically includes (but not limited to) an Intel i7 processor, ATX motherboard to your specifications, 32 GB memory, storage options, latest Windows operating system, USB 3.0 ports, a card reader for extra security, fiber port options, DB9/DB37 connectors, and high-performance power line filter. The system measures 18.50" high × 6.65" wide × 17.50" deep.

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Rugged Single Board Computer

WINSYSTEMS (Grand Prairie, TX) announced its latest enclosed single board computer for extreme operating temperatures and environments. The SYS-427 is a complete system in a rugged aluminum enclosure that measures a mere 6.5 inches by 4.5 inches and only 1.38 inches in height (165 mm × 115 mm × 35 mm). Within those chassis confines are WINSYSTEMS’ SBC35-427 single board computer, dual Gigabit Ethernet controllers, two USB 3.0 ports, two USB 2.0 ports and dual DisplayPort outputs. Mini-Card and M.2 connectors provide additional expansion options.

The rugged new SYS-427 SBC withstands the shock and vibration demands of industrial environments while also accommodating DC power inputs ranging from 10 to 50 volts DC. Further, the Trusted Platform Modules (TPM) 2.0 device is soldered onboard to authenticate root of trust and enable security. Operating temperature range is -40C to +85C.

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Dual FMC+ Carrier with Xilinx Zynq®UltraScale+ FPGA

VadaTech (Henderson, NV) has announced the new AMC560, an AMC FPGA Carrier with dual FMC+ (VITA 57.4) interfaces, compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. The unit has a Xilinx UltraScale+ XCZU19EG MPSoC FPGA that provides 1,968 DSP Slices and 1,143k logic cells. The Zynq Ultra-Scale+ EG devices feature a quad-core ARM® Cortex-A53 platform running up to 1.5 GHz, combined with dual-core Cortex-R5 realtime processors and a Mali-400 MP2 graphics processing unit.

The onboard reconfigurable FPGA interfaces directly to the AMC FCLKA, TCLKA-D, FMC+ DP0-16 and all FMC+ LA/HA/HB pairs. The FPGA has an interface to a single DDR4 memory channel (64-bit wide with ECC), which allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. The module has onboard 64 GB of Flash, 128 MB of boot flash and a SD Card as an option.

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