Products

Mobile Workstation

Eurocom's (Ottawa, Canada) latest mobile workstation, the Tornado F7W, features a modular MXM 3.1 slot-based GPU allowing easy reconfiguration of GPU capabilities. The GPUs offered are ISV-certified, workstation-class NVIDIA Quadro P5200, P4200 and P3200 cards, which are suitable for CAD/CAE/CAM software such as Adobe, AutoCAD, CATIA and SOLIDWORKS. Over time, a user can choose to swap out the Quadro-based GPU and reconfigure the system to run a different MXM 3.1-compatible GPU (GTX-based cards, for example).

Eurocom systems are also highly reconfigurable in terms of their memory (RAM). The Tornado F7W has up to 4 × SODIMM sockets and can be reconfigured in different combinations to support as much as 128 GB of DDR4 RAM (4 × 32 GB RAM). Additional storage can be added at any time as need arises. Tornado F7W comes with 5 physical drive bays (3 × M.2 NVMe and 2 × 2.5”) capable of supporting up to 22TB of storage. It also supports multiple RAID options including RAID 0/1/5/10. Each 2.5” bay is capable of handling up to 8TB of SSD per bay, and each M.2 slot supports up to 2TB SSD.

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Fanless Embedded Computer

With the PIP40, MPL (Dattwil, Switzerland) presents its newest fanless embedded computer family with the 8th generation Intel processors. The basic version is equipped with interfaces such as display port, DVI-D, USB 3.1, RS232/422/485, etc. Further expansion can be done over the internal expansion interfaces such as mPCIe, m.2 or PCIe/104. WLAN, LTE, GPIOs, and CAN. SATA, mSATA and m.2 can be used for mass storage.

MPL offers the PIP46 with the i7-8850H embedded CPU. The PIP46 is currently available in MPL's standard housing with DIN-Rail or flange mounting. Further housings such as MIL and 19” racks are in preparation. The open frame version (CPU board on cooling plate) is best suited for installation in an existing cabinet and tight areas. For applications with vibrations, the solution can be supplied with lockable headers. The PIP40 Family can be put into various standby mode levels (even below 95 mW) and with Wake On LAN (WOL), the system can be started. The operational power consumption is between 5 and 65W and the power consumption level can be limited.

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Thermal-Acoustic Enclosure Insulation

Elasto Proxy (Boisbriand, Canada) recently announced SH-625-ZTBRA thermalacoustic insulation for maximum sound attenuation over a broad frequency range. This enclosure insulation sandwiches a vibration damper between acoustical foams and includes a metal foil facing that reflects radiant heat. For ease-of-installation, an adhesive-backed liner is used. SH-625-ZTBRA thermal-acoustic insulation is dense and flexible but supports water jet cutting to accommodate specific shapes and geometries.

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Mini PCIe-Based Serial I/O Modules

Acromag (Wixom, MI) continues to expand their offering of AcroPack rugged I/O modules based on the PCI Express mini card (mPCIe) standard with a new isolated RS232 communication module. The AP513 module provides four individually isolated RS232 serial ports on a compact 30 × 70 mm board. Each port is isolated to 250V from digital circuitry and 100V from the other 3 ports. The isolation protects equipment and signal integrity in electrically noisy environments with potential for high common model voltages, harmful transient signals, and ground loops.

Designed for COTS applications, these mPCIe mezzanine modules deliver a SWaP-optimized solution for military, aerospace, and industrial systems performing data collection, control, test, and simulation functions. A variety of carrier cards are available to host a mix of up to four AcroPack I/O modules on PCI Express, VPX, CompactPCI-Serial, or other small form factor computer platforms.

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Current Sensor Modules

TT Electronics (Woking, UK) announced an innovative approach to developing customized current sensor modules for the harsh environment requirements of the aerospace and defense market. Ambient temperature ranges of -55°C to +125°C and a 30A to 2000A AC or DC capability make these current sensor modules ideally suited for electrical systems, generators and motor drive applications.

With a generic single-phase configuration, these TRL5 standard circuit boards can be coated, fully potted, built into a housing, or re-configured into a multi-phase product. Building on the company's existing range of current sensor modules, this new and highly diverse modular technique leverages Hall-Effect and Rogowski sensors, as well as amplifiers and digital converters. Such flexibility of design enables the customer to select key sensor parameters to create their very own unique fit.

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Ceramic Hermetic DDR2 Memory

Data Device Corporation (DDC) (Bohemia, NY) has introduced the first CCGA Rad-Hard DDR2 SDRAM for space applications, the latest addition to DDC's wide range of high-density space grade ceramic hermetic memories, spanning Flash (NAND/NOR), SDRAM, SRAM and EEPROM solutions. The new DDR2 (97D2H) offers up to 8 Gb of SDRAM in a compact CCGA package (1.1 in. × .717 in. footprint & low .325 in. height profile).

The hermetic ceramic packaging provides excellent radiation tolerance for TID (>100 krad orbit/mission dependent) and Single Event Effects (no latch up), while the universal package accommodates multiple density and data width options to enable simplified board design, system integration and error correction implementation. Wide data bus options (×8, ×16, ×32, ×48, ×64, ×80), for simple connectivity to Rad-Hard FPGAs, ASICs and processors, with support for implementation of various error correction schemes.

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Mission-Critical Software

Mercury Systems, Inc. (Andover, MA) announced availability of the full range of flightsafety certification levels in its ROCK-2 mission computing architecture, allowing customers to focus on developing critical aviation applications, while reducing system development time and cost. ROCK-2 customers now have access to the complete range of design assurance levels (DAL), from DAL-E to the highest, DAL-A, and the critical safety assurance they need for a growing number of mission critical applications, including avionics, vetronics for defense and commercial fixed and rotary-wing platforms, ground stations, unmanned aerial vehicles (UAVs), and urban air mobility platforms (UAM).

The ROCK-2 architecture features BuiltSAFE™ technology. The ROCK-2 platform is an open systems-compliant, 3U OpenVPX™ form factor that is fully compatible with the Sensor Open Systems Architecture (SOSA). Together, ROCK-2 and BuiltSAFE™ offer customers an extensive portfolio of interoperable processing hardware, software, networking, datalink, graphics and I/O building blocks with supporting flight-safety certification artifacts.

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Buck Boost Evaluation Kit

Richardson RFPD (Geneva, IL) Inc. has announced the availability and full design support capabilities for a new buck boost evaluation kit from Wolfspeed, a Cree Company. The KIT-CRD-3DD12P buck boost evaluation kit is optimized to demonstrate the high-speed switching capability of Wolfspeed's third generation (C3M) silicon carbide MOSFETs. The board features SMA connectors for monitoring the gate-to-source voltage. The SMA connectors offer cleaner waveforms than traditional probes and ground leads.

This evaluation kit supports 4-lead and 3-lead TO-247 package MOSFETs, as well as diodes in TO-247 and TO-220 packages. The kit contains a heatsink, thermal interface, inductor, needed hardware, and two Wolfspeed C3M MOSFETs. Electrical specifications of the new kit include: Max input voltage of 800 VDC; max output voltage of 800 VDC; output power of 2500W (higher power operation is possible with a different inductor); and switching frequency of 100 kHz (higher frequency operation is possible but may require a different inductor).

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