Lange Couplers

The construction and port orientation of the Lange Coupler from SemiGen (Londonderry, NH) makes it useful as both a power combiner and splitter for RF and microwave applications. It is a specific type of directional coupler, which allows passive coupling of a defined amount of electromagnetic power. The sweet spot for Lange Couplers has traditionally been UHF to Q-band; the limit becomes frequency. Substrate height and strip width are inversely related to frequency, increasing loss due to the reduced amount of metal available to act as a conductor.

dB and frequency ranges in which Lange Couplers provide the biggest performance advantages, in terms of low loss, compact layout and wide bandwidth are: < 0.4 dB on 10 GHz frequencies (low loss); as low as 10μm lines and spacing (layout); and 10-50 GHz bandwidth.

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Custom Microelectronics

Mercury Systems, Inc. (Andover, MA) announced the defense industry's first trusted custom microelectronics capability targeting SWaP-constrained intelligent sensors for military applications. With tightly integrated design and manufacturing resources, the company has developed deep domain expertise spanning a broad of range of capabilities ideally suited to custom microelectronics for defense applications such as: advanced packaging technologies with surface-mount, flip chip, and wire bond; 2.5D and 3D packaging; thermal management; ruggedization; radio frequency (RF), microwave and mixed signal; scalable manufacturing; advanced testing protocols; and a robust cybersecurity posture.

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Horizontal Machining Center

Mitsui Seiki's (Franklin Lakes, NJ) new HU100-TS 100 tilt-spindle 5-axis horizontal machining center is built to machine large, hard-metal workpieces that are better suited for tilt-spindle processing than trunnion table operations. The horizontal table of the HU-100TS can accommodate workpieces up to 1,900 mm (76”) long and 1,250 mm (50”) in diameter, weighing up to 2,000 kg (4,400 lbs.). X, Y and Z-axis travels are 1,300 mm (52”), 1,500 mm (60”) and 1,400 mm (56”) respectively, with B-axis rotation of 360° and A-axis rotation of -30° to +120°. The machine's compact 5,530 mm (221”) x 8,431 mm (337”) footprint is similar to that of its 4-axis equivalent.

The machine's HSK-A100 taper spindle provides up to 150 kW (201 hp) power and 1508 N-m (1,112 lb-ft) torque. A standard automatic tool changer has capacity for 60 tools (180 optional), up to 500 mm (20”) in length. Maximum tool diameter is 125 mm (5”); tools stored without adjacent tools can be up to 216 mm (8.6”) in diameter.

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Servo-Electric Presses

Beckwood Press Company (St. Louis, MO) announced the launch of EVOx™, a complete line of servo-electric presses. With models ranging from 1,000 lbf – 100,000 lbf (0.5 - 50 tons), EVOx presses are suitable for light-duty assembly applications including clamping, crimping, joining, press fitting, punching/blanking, riveting, spring testing, staking, and swaging.

The EVOx™ line of presses is powered by Exlar® electric roller-screw actuators from Curtiss-Wright, in lieu of hydraulic systems. Eliminating the hoses, pumps, and hydraulic oil improves cleanliness, energy efficiency, and operator safety while lowering operational and maintenance costs. The roller-screw technology ensures Exlar® actuators last longer than traditional ball-screw actuators.

VOx™ presses feature a programmable, intuitive controls system that guarantees positional repeatability to within +/-0.0005” while offering force and positional feedback. Additionally, actuator size, frame style, dwell time, safety guarding, and other parameters are fully configurable.

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Robotics Enclosures

HEMCO (Independence, MO) enclosures are designed to enclose robots and other lab automated processes by providing exhaust air systems or HEPA filtered clean workstations. Enclosures are built to protect robotic processes from contamination and personnel from hazardous fumes. Utilizing a flexible, modular design, enclosures are engineered and built to exact customer size and design requirements. HEMCO also offers a wide selection of standard sizes in vented or HEPA filtered models.

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“Green” Graphene

Goodfellow (Coraopolis, PA) recently announced the availability of ultra-pure “green” graphene, guaranteed metal-free and uniquely applicable in metal-sensitive processes. The graphene is produced by means of a highly scalable process that involves breaking methane gas (CH4), a very potent greenhouse gas, into hydrogen and elemental carbon atoms in a plasma reactor. The carbon atoms then recombine into graphene sheets in the hydrogen atmosphere. Elapsed time from the methane gas entering the plasma reactor to the point when graphene is formed is less than a second.

The resulting graphene nanoplatelets are very thin and slightly crumpled and they do not stack (unlike exfoliated materials), ensuring optimal electrical, thermal and mechanical performance. These characteristics make this easy-to-use product an extremely good nanofiller suitable for electronic inks, polymers, metal composites and coating.

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