Test Socket Thermal Solutions
Aries Electronics (Bristol, PA) recently introduced a new thermal profiling solution for its test and burn-in socket line of products. Unlike standard heat-sink and fan options, this solution incorporates advanced thermal profiling software to develop an application/IC specific thermal analysis for each customer’s requirement(s).
The software will analyze all of the necessary parameters within the socket/IC/test environment and determine the correct heat sink/fan/cooling combination necessary to optimize the test and burn-in application, enabling the socket to be thermally correct before it is placed into its final environment. New thermal profiles are initiated using an online fill-in .pdf form linked from all of Aries’ test and burn-in socket pages.
For Free Info Click Here
Top Stories
INSIDERManned Systems
Turkey's KAAN Combat Aircraft Completes First Flight - Mobility Engineering...
INSIDERMaterials
FAA Expands Boeing 737 Investigation to Manufacturing and Production Lines -...
INSIDERImaging
New Video Card Enables Supersonic Vision System for NASA's X-59 Demonstrator -...
INSIDERManned Systems
Stratolaunch Approaches Hypersonic Speed in First Powered TA-1 Test Flight -...
INSIDERUnmanned Systems
Army Ends Future Attack and Reconnaissance Helicopter Development Program -...
ArticlesEnergy
Can Solid-State Batteries Commercialize by 2030? - Mobility Engineering...
Webcasts
AR/AI
From Data to Decision: How AI Enhances Warfighter Readiness
Energy
April Battery & Electrification Summit
Manufacturing & Prototyping
Tech Update: 3D Printing for Transportation in 2024
Test & Measurement
Building an Automotive EMC Test Plan
Manufacturing & Prototyping
The Moon and Beyond from a Thermal Perspective
Software
Mastering Software Complexity in Automotive: Is Release Possible...