A Thermal Analysis tool from Custom MMIC (Westford, MA) estimates the rise in temperature between the ambient surrounding and the bottom of a packaged MMIC when attached to a printed circuit board (PCB). The online calculator does not require a full 3D thermal simulation environment. Users select the package type, the power dissipation inside the package, the PCB board material, the via construction, and the base plate temperature (typically 85°C). The calculator then determines the temperature rise through the PCB to the bottom of the package, under the following assumptions: the PCB is plated with 1 oz. copper (1.4 mils thick), the package is attached to the PCB with solder (2 mils thick), and the base plate is an ideal heat sink.

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Aerospace & Defense Technology Magazine

This article first appeared in the April, 2014 issue of Aerospace & Defense Technology Magazine.

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