Copper Via Process for Thin Film Substrates
UltraSource, Inc. (Hollis, NH), a supplier of custom thin film circuits and ceramic interconnect devices, has announced the new CopperViaTM, based on their existing patented UltraVia process. The CopperViaTM process fills vias with pure copper material in order to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraViaTM, the CopperViaTM virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.
Solid filled vias provide a low inductance, microwave grounding path, allowing high performance RF circuits to be assembled in a thermally efficient surface mount configuration. The CopperVia enables a lower cost thin film structure than using other precious metals for making a signal or power interconnect between the planar layers of high frequency circuits and meets the reliability requirements for harsh environment applications such as defense and security systems, fiber optic transceivers, infrared detection, radar, and medical applications.
For Free Info Click Here
Top Stories
INSIDERManned Systems
Turkey's KAAN Combat Aircraft Completes First Flight - Mobility Engineering...
INSIDERMaterials
FAA Expands Boeing 737 Investigation to Manufacturing and Production Lines -...
INSIDERImaging
New Video Card Enables Supersonic Vision System for NASA's X-59 Demonstrator -...
INSIDERManned Systems
Stratolaunch Approaches Hypersonic Speed in First Powered TA-1 Test Flight -...
INSIDERUnmanned Systems
Army Ends Future Attack and Reconnaissance Helicopter Development Program -...
ArticlesEnergy
Can Solid-State Batteries Commercialize by 2030? - Mobility Engineering...
Webcasts
AR/AI
From Data to Decision: How AI Enhances Warfighter Readiness
Energy
April Battery & Electrification Summit
Manufacturing & Prototyping
Tech Update: 3D Printing for Transportation in 2024
Test & Measurement
Building an Automotive EMC Test Plan
Manufacturing & Prototyping
The Moon and Beyond from a Thermal Perspective
Software
Mastering Software Complexity in Automotive: Is Release Possible...