Advanced Cooling Technologies (ACT) (Lancaster, PA) has developed a vapor chamber that allows for higher density electronic component installation. ACT vapor chambers are planar heat pipes used to spread concentrated heat, with thermal conductivities exceeding that of copper interface materials. By designing vapor chambers out of a copper-plated ceramic casing, the coefficient of thermal expansion (CTE) can be matched to that of the high-heat-flux silicon semiconductor materials for direct bonding. The ACT vapor chamber has an evaporator wick structure that handles heat fluxes up to 500 W/cm2. The overall resistance of the vapor chamber is less than 0.12 °C-cm2/W. The devices also work in conjunction with natural convection, forced convection, or liquid cooling.
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