Features

Pin Fin Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) (Norwood, MA) has a family of Pin Fin heat sinks designed as cost-effective solutions for systems with adequate airflow. The high aspect ratio design enables ATS Pin Fin heat sinks to provide low thermal resistance from base to fins in systems where the airflow measures 200-plus LFM (linear feet per minute). The cross-cut design also allows the Pin Fin heat sinks to be effective in systems where airflow is ambiguous.

These high-efficiency platform products, made from extruded aluminum, are available in component sizes from 10 mm × 10 mm to 60 mm × 60 mm. Heat sink heights range from 2 mm to 25 mm. At higher airflows, ATS Pin Fin Heat Sinks can provide thermal resistance as low as 2.5°C/W without adding significant cost or weight to the design.

Pin Fin heat sinks can be attached with standard thermal tape or with ATS clipKIT™, featuring either maxiGRIP™ or superGRIP™ two-component mechanical attachment systems that securely mount a heat sink to a component without needing to drill holes and with minimal additional footprint.

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Unmanned Aircraft Systems Upgrades

AeroVironment Inc. (Monrovia, CA) announced that its Puma™ AE and Raven® small unmanned aircraft systems are being enhanced with new upgrades that include durability enhancements to the aircraft to operate in more rugged environments, improved ability to support advanced third-party payloads and software applications and enhanced performance in challenging radio electronic warfare/cyber environments where interference is prevalent.

Puma 3 features enhanced composite structures to support landing with heavier configurations and at higher altitudes. PUMA 3 will incorporate a new, more efficient smart battery as well as enhancements to battery safety. Raven 3 will feature a new smart battery with an integrated state-of-the-charge indicator and improved safety and reliability during charging and flight operations. Raven 3 will also include an optional AVTracker capability, which improves Raven’s ability to maintain “eyes on target.”

Both models will be equipped with Digital Data Link (DDL) security upgrades to support operation in more challenging RF environments and will include M1/M2/M5 radio frequencies to conform seamlessly and securely to the Department of Defense’s new frequency spectrum allocation.

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Removable Storage Module

Aitech Defense Systems Inc. (Chatsworth, CA) now offers its A172, a low-power, highperformance rugged compact PC (RCP) with a removable storage module that meets DoD 5220.22-M for quick/secure erase. The 1 TB, secure SSD offers MLC and SLC NAND Flash, as well as a sustainable read/write speed of up to 400 MB/sec. The low-profile A172 is a compact 10.24” × 7.09” × 1.8” (260 mm x 180 mm x 46 mm), featuring a powerful Intel Core i7 or Xeon processor and multiple standardized modules.

In addition, the RCP offers added design flexibility with DVI and RS-170A RGBHV video output options, optional WiFi and frame grabber video inputs as well as TPM (trusted platform management) and a 50 ms holdup option for increased system reliability. The rugged unit offers two standard I/O variants, with user-specific configurations available. Options include up to four independent Gigabit Ethernet interfaces, four USB 2.0 interfaces and eight serial ports with multiple RS232, RS422 or RS485 configurations as well as two CANbus and eight single-ended, buffered LVTTL discrete digital I/O ports.

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Software Radio Receiver

Pentek, Inc. (Upper Saddle River, NJ) announced the newest member of its Jade® family of high-speed data converter XMC FPGA modules: the 2-channel Jade Model 71865, a 200 MHz 16-bit A/D channelizer with 762 narrowband digital down converters (DDCs) and 4 wideband DDCs, based on the Xilinx Kintex UltraScale FPGA. The Model 71865 functions include two A/D acquisition IP modules for simplifying data capture and transfer.. From each of the two acquisition modules, A/D sample data flows into identical IP modules consisting of banks of wideband and narrowband DDCs. Finally, data is delivered to four DMA controllers linked to the PCIe Gen.3 x8 interface for transfer to a signal processor.

The four wideband DDCs can be set for decimation values between 8 and 128 in steps of 4, providing usable output bandwidths from 1.25 MHz to 20 MHz. Each of the six narrowband DDC banks can be configured to operate in three different modes, where each mode provides a different quantity of DDC channels and range of decimations. Output bandwidths range from 20 kHz to 1.25 MHz. All DDCs can be independently tuned from 0 Hz to 200 MHz with 32 bits of resolution.

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S-Band Radar Rotating Joint Assembly

Link Microtek (Hampshire, UK) has successfully created and shipped a complex, one-meter-long microwave rotating joint assembly for an S-band ground-based radar. Allowing microwave signals to be fed to and from a radar antenna, such large rotating joint assemblies are an essential component of the S-band radar systems that are used around the world in air-traffic control, weather forecasting and shipborne applications.

The rotating joint assembly incorporates one WR284 waveguide channel for 2.7-3.1 GHz (S-band) transmissions up to a peak power of 200 kW, four N-type coaxial channels for 2.7-3.1 GHz transmissions up to a peak power of 1 kW, two N-type coaxial channels for 1.0-1.1 GHz (L-band) transmissions with a peak power of 10 kW, and a 35-way slip ring and brush block for feeding DC power to the antenna.

As is usual for radar applications, the assembly had been specified for continuous rotation at up to 60 rpm, so the finished unit was subjected to a prolonged run-in program and comprehensive electrical testing on a custom-built test rig at Link Microtek’s Basingstoke facility.

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Inspection Software

EyeVision software from EVT (Karlsruhe, Germany) offers new thermal imaging commands with release 3.7, allowing both active and passive thermal imaging. The nondestructive detection of hidden materials in plastics or openings in foam is now possible. Even surface shapes of transparent materials can be perceived and errors detected, such as those in adhesive beads, etc.

EyeVision supports various IR cameras, for example by Optris and Flir. In addition Eye-Vision supports nearly every platform: GigE, USB 2.0 and 3.0, RS232, Camera Link, FireWire, CoaXPress, etc. EyeVision runs on various embedded boards such as Raspberry Pi, Odroid, Pine, as well as EVT’s own SPS-IO-Module and IoCap (Capture-and-IO-Board).

Besides the thermal and hyperspectral imaging commands, EyeVision also has many commands for metrology, 3D point cloud measurements, surface inspection, object counting, code reading (bar code, QR, DMC), OCR/OCV, pattern matching, color recognition and many special solutions.

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