Semiconductors & ICs

Broadband 1.2- and 2.4-mm Gallium Nitride (GaN) Power Amplifier Designs

The US Army Research Laboratory (ARL) has been working with Raytheon to design efficient, broadband, linear, high-power amplifiers and robust, broadband, low-noise amplifiers for future adaptive, multimodal radar systems. Raytheon has a high-performance, W-band, gallium nitride (GaN) fabrication process and a process design kit (PDK) that ARL used to design low-noise amplifiers, power amplifiers, and other circuits for future radar, communications, and sensor systems. After the first set of ARL and Raytheon designs was submitted for fabrication, test designs of broadband Class A/B power amplifiers were developed. While these designs did not get fabricated in the initial effort, they serve to demonstrate the performance, bandwidth, and capability of this GaN process and could potentially be fabricated in the future.

Posted in: Articles, Aerospace, Defense, Electronic Components, Power Management, Power Supplies, Mechanical Components, RF & Microwave Electronics, Semiconductors & ICs
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Electrical Characterization of Crystalline UO2, THO2 and U0.71TH0.29O2

Tracking and identifying radiation sources in the age of nuclear proliferation and well- resourced non-state actors is a national priority. Current neutron detection methods favor large detector volumes and long data collection times. Additionally, portable neutron detection methods have persistent problems with low signal-to-noise (small pulse height) and require large applied voltages.

Posted in: Briefs, Aerospace, Defense, Materials, Mechanical Components, MEMs, Semiconductors & ICs, Data Acquisition, Detectors, Sensors
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Using RISC-V to Simplify Data Logging in Space

Worldwide demand for low Earth orbit satellites is increasing at an unprecedented pace, driven by diverse needs such as faster and more affordable Internet access, and faster revisit rates with finer resolution for imaging data. The satellite payload instruments performing communications or imaging functions are becoming increasingly sophisticated and capable and require the collection of increasing amounts of telemetry data to ensure the safe and reliable operation of the satellite.

Posted in: Articles, Aerospace, Data Acquisition, Power Management, Thermal Management, Mechanical Components, Medical, Patient Monitoring, Semiconductors & ICs, Data Acquisition, Detectors, Instrumentation, Measuring Instruments, Monitoring, Test & Measurement
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Streamlining EMC Solutions for Avionics Interfaces

Lightning strikes to jet airliners are common - about once every 1000 flight hours. The DO-160G standard, Environmental Conditions and Test Procedures for Airborne Equipment, is a standard for the environmental testing of avionics hardware. Many airplane manufacturers specify DO-160G Section 22, lightning induced transient susceptibility, as a requirement for critical systems like guidance, radars, communications, engine control, and heat and air controls. Aircraft fuselage, wing and tail flight controls, wing tips, fin tips, engine nacelles, and landing gear are the areas most likely to be hit by lightning strikes.

Posted in: Articles, Aeronautics, Aerospace, Aviation, Communications, Electronic Components, Semiconductors & ICs, Test & Measurement
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Putting FPGAs to Work in Software Radio Systems

FPGAs have become an increasingly important resource for software radio systems. Programmable logic technology now offers significant advantages for implementing software radio functions such as DDCs (Digital Downconverters). Over the past few years, the functions associated with DDCs have seen a shift from being delivered in ASICs (Application-Specific ICs) to operating as IP (Intellectual Property) in FPGAs.

Posted in: White Papers, White Papers, Electronics & Computers, Semiconductors & ICs
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Compact Power Amplifier Solution for Electronic Warfare

Wolfspeed, a Cree company, provides field-tested silicon carbide (SiC) and gallium nitride (GaN) power and RF solutions. As a leader in wide-bandgap semiconductor technology, Wolfspeed partners with designers to build faster, smaller, lighter, and more powerful electronic systems.

Posted in: Articles, Aerospace, Defense, Board-Level Electronics, Power Management, Power Supplies, Materials, Machinery, Mechanical Components, Power, Power Transmission, RF & Microwave Electronics, Semiconductors & ICs
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Integrated Magneto-Optical Devices for On-Chip Photonic Systems

The magneto-optical (MO) oxide layer consists of (Bi,Y)3Fe5O12 or BiYIG, bismuth garnet. This material was selected because it has a better figure of merit than the CeYIG previously used, especially at lower wavelengths (1310 nm vs. 1550 nm). A top-down deposition process was developed in which BiYIG/YIG stacks are grown on the Si waveguide with YIG on top. The stack is annealed at 800°C/5 min to crystallize both layers, with the YIG templating the BiYIG leading to garnet phases rather than other oxides, and the BiYIG is directly on the Si waveguide. Initial attempts led to a film with Bi oxide phases, because the Bi was in excess and could not escape during the anneal as occurs in Si/YIG/BiYIG stacks. Hence the composition was adjusted to include slightly more Fe, which yielded films with only garnet peaks.

Posted in: Briefs, Aeronautics, Aerospace, Aviation, Electronic Components, Electronics, Electronics & Computers, Manufacturing & Prototyping, Materials, Optical Components, Optics, Photonics, Semiconductors & ICs
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Ultracompact, High-Speed Field-Effect Optical Modulators

The major goals of this research project included two parts. First, an ultracompact plasmonic electro-optical (EO) modulator was to be developed and investigated for efficient intensity modulation. Second, an ultracompact and high-speed EO modulator based on a dielectric platform was to be developed for straightforward integration with existing CMOS technology. Both modulators were targeted to facilitate next-generation interconnects for integrated photonic circuits.

Posted in: Briefs, Aeronautics, Aerospace, Aviation, Joining & Assembly, Mechanical Components, Optical Components, Optics, Photonics, Semiconductors & ICs
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Merging Antenna and Electronics Boosts Energy and Spectrum Efficiency

By integrating the design of antennas and electronics, researchers from the Georgia Institute of Technology have boosted the energy and spectrum efficiency for a new class of millimeter-wave transmitters, allowing improved modulation and reduced generation of waste heat.

Posted in: Articles, Aerospace, Electronics, Electronics & Computers, Energy, Energy Efficiency, Smart Grid, Antennas, RF & Microwave Electronics, Semiconductors & ICs
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Taming the Thermal Behavior of Solid-State Military Lasers

Laser diodes and laser diode arrays (LDAs) are widely used throughout military systems, for sighting and range finding, but also at high power levels as offensive and defensive weapons. In companion with much higher-power chemical lasers, these high-power optical sources can generate kilowatts of optical power (as arrays) for use in neutralizing incoming missiles, rockets, and armaments and for long-distance offensive strikes. But laser diodes are also still inefficient, and a great deal of the energy supplied to a laser diode or an LDA is converted into heat, which must be safely dissipated to ensure a long operating lifetime for the solid-state devices.

Posted in: Articles, Aerospace, Board-Level Electronics, Electronics & Computers, Power Management, Thermal Management, Ceramics, Materials, Metals, Packaging, Lasers & Laser Systems, Optics, Photonics, Semiconductors & ICs
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