Semiconductors & ICs

Molecular Engineering for Mechanically Resilient and Stretchable Electronic Polymers and Composites

The ability to predict the mechanical properties of organic semiconductors is of critical importance for roll-to-roll production and thermomechanical reliability of organic electronic devices. This research describes the use of coarse-grained molecular dynamics simulations to predict the density, tensile modulus, Poisson ratio, and glass transition temperature for poly(3-hexylthiophene) (P3HT) and its blend with C60. In particular, it is shown that the resolution of the coarse-grained model has a strong effect on the predicted properties.

Posted in: Briefs, Aerospace, Defense, Electronic Components, Electronics, Electronics & Computers, Composites, Materials, Mechanical Components, Semiconductors & ICs
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Electrodeposition of Metal Matrix Composites and Materials Characterization for Thin-Film Solar Cells

Metal matrix composites can electrically bridge the cracks that appear in semiconductor substrates and the composite grid lines.
Posted in: Briefs, Aerospace, Solar Power, Composites, Materials, Metals, Mechanical Components, Semiconductors & ICs
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S-Band Radar Systems

Artillery in the wrong hands pose an increased risk to the safety of U.S. service members, allies and civilians.
Posted in: Application Briefs, Defense, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, RF & Microwave Electronics, Semiconductors & ICs
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Tips for Reducing Error When Using Eddy Current Measuring Techniques

Inductive eddy current technology is an extremely versatile non-contact method for measuring an object's position, distance, or vibration.
Posted in: Articles, Aerospace, Defense, Metals, Semiconductors & ICs, Instrumentation, Measuring Instruments, Metrology, Monitoring, Test & Measurement, Testing Procedures
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Shape-Shifting Origami Could Help Antenna Systems Adapt On-the-Fly

Conventional reconfigurable electrical and radio frequency (RF) structures commonly used in applications involving real-time reconfigurability in response to fast varying operational scenarios require specialized substrates or complex electrical circuits. Origami-based RF reconfigurable components and modules offer a solution with unique properties. First, they enable re-configurability over continuous-state ranges (as opposed to discrete states). Second, they do not require specialized mechanical support for multilayer frequency-selective surface structures. Moreover, deployable origami-based RF structures can achieve large surface re-configurability ratios from folded to unfolded states. Finally, these structures allow for independent control of multiple figures of merit: bandwidth, frequency of operation, and angle of incidence.

Posted in: Articles, Aerospace, Communications, Defense, Electronic Components, Electronics, Electronics & Computers, Energy, Energy Harvesting, 3 D Printing & Additive Manufacturing, Manufacturing & Prototyping, Antennas, RF & Microwave Electronics, Semiconductors & ICs, Sensors
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Operational Considerations for High-Reliability Interconnects in Military and Aerospace Applications

In the recent past, military acquisition has shifted from being locked into large long-term contracts to developing complex systems in discrete increments that can be further optimized in future design cycles. These shorter design cycles allow for equipment to be deployed more rapidly, thereby mitigating the risk of subsystems going obsolete as increasing proportions of budget dollars go towards operation and support (O&S). This transition to evolutionary acquisition (EA) leaves a major opportunity for vendors to develop commercial off-the-shelf (COTS) components that are military-compliant.

Posted in: Articles, Aerospace, Manufacturing & Prototyping, Fastening, Joining & Assembly, Mechanical Components, RF & Microwave Electronics, Semiconductors & ICs, Test & Measurement
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Acceleration Resistant HiK Heat Spreader

As electronic technologies advance in defense and aerospace applications, heat fluxes are becoming larger and more centralized[1,2]. In order to meet the performance specifications of new technologies, thermal solutions must also advance. The push for more capable thermal technologies is evident with the U.S. Air Force Research Laboratory (AFRL) signing an agreement with private companies and contractors for the development of innovative vapor cooling technologies capable of handling high heat fluxes[2].

Posted in: Articles, Aerospace, Electronic Components, Electronics & Computers, Power Management, Power Supplies, Thermal Management, Materials, Metals, Power, Semiconductors & ICs
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Broadband 1.2- and 2.4-mm Gallium Nitride (GaN) Power Amplifier Designs

The US Army Research Laboratory (ARL) has been working with Raytheon to design efficient, broadband, linear, high-power amplifiers and robust, broadband, low-noise amplifiers for future adaptive, multimodal radar systems. Raytheon has a high-performance, W-band, gallium nitride (GaN) fabrication process and a process design kit (PDK) that ARL used to design low-noise amplifiers, power amplifiers, and other circuits for future radar, communications, and sensor systems. After the first set of ARL and Raytheon designs was submitted for fabrication, test designs of broadband Class A/B power amplifiers were developed. While these designs did not get fabricated in the initial effort, they serve to demonstrate the performance, bandwidth, and capability of this GaN process and could potentially be fabricated in the future.

Posted in: Articles, Aerospace, Defense, Electronic Components, Power Management, Power Supplies, Mechanical Components, RF & Microwave Electronics, Semiconductors & ICs
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Electrical Characterization of Crystalline UO2, THO2 and U0.71TH0.29O2

Tracking and identifying radiation sources in the age of nuclear proliferation and well- resourced non-state actors is a national priority. Current neutron detection methods favor large detector volumes and long data collection times. Additionally, portable neutron detection methods have persistent problems with low signal-to-noise (small pulse height) and require large applied voltages.

Posted in: Briefs, Aerospace, Defense, Materials, Mechanical Components, MEMs, Semiconductors & ICs, Data Acquisition, Detectors, Sensors
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Using RISC-V to Simplify Data Logging in Space

Worldwide demand for low Earth orbit satellites is increasing at an unprecedented pace, driven by diverse needs such as faster and more affordable Internet access, and faster revisit rates with finer resolution for imaging data. The satellite payload instruments performing communications or imaging functions are becoming increasingly sophisticated and capable and require the collection of increasing amounts of telemetry data to ensure the safe and reliable operation of the satellite.

Posted in: Articles, Aerospace, Data Acquisition, Power Management, Thermal Management, Mechanical Components, Medical, Patient Monitoring, Semiconductors & ICs, Data Acquisition, Detectors, Instrumentation, Measuring Instruments, Monitoring, Test & Measurement
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