The ability to predict the mechanical properties of organic semiconductors is of critical importance for roll-to-roll production and thermomechanical reliability of organic electronic devices. This research describes the use of coarse-grained molecular dynamics simulations to predict the density, tensile modulus, Poisson ratio, and glass transition temperature for poly(3-hexylthiophene) (P3HT) and its blend with C₆₀. In particular, it is shown that the resolution of the coarse-grained model has a strong effect on the predicted properties.

Conventional reconfigurable electrical and radio frequency (RF) structures commonly used in applications involving real-time reconfigurability in response to fast varying operational scenarios require specialized substrates or complex electrical circuits. Origami-based RF reconfigurable components and modules offer a solution with unique properties. First, they enable re-configurability over continuous-state ranges (as opposed to discrete states). Second, they do not require specialized mechanical support for multilayer frequency-selective surface structures. Moreover, deployable origami-based RF structures can achieve large surface re-configurability ratios from folded to unfolded states. Finally, these structures allow for independent control of multiple figures of merit: bandwidth, frequency of operation, and angle of incidence.

In the recent past, military acquisition has shifted from being locked into large long-term contracts to developing complex systems in discrete increments that can be further optimized in future design cycles. These shorter design cycles allow for equipment to be deployed more rapidly, thereby mitigating the risk of subsystems going obsolete as increasing proportions of budget dollars go towards operation and support (O&S). This transition to evolutionary acquisition (EA) leaves a major opportunity for vendors to develop commercial off-the-shelf (COTS) components that are military-compliant.