Semiconductors & ICs

Weyl Semimetals (WSM) for Electronics Applications

New synthesized materials open the way to govern the density of helicity, axial charge, and its flow, axial current.
Posted in: Briefs, Aerospace, Electronics, Electronics & Computers, Materials, Semiconductors & ICs
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Future Advances in Electronic Materials and Processes - Flexible Hybrid Electronics

There are still significant obstacles to the manufacture and use of flexible hybrid electronics in military applications.
Posted in: Briefs, Aerospace, Defense, Electronic Components, Electronics, Electronics & Computers, Power Management, Power Supplies, Materials, Photonics, Semiconductors & ICs, Sensors
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Calculating Electrical Requirements for Direct Current Electric Actuators

When designing electro-mechanically actuated systems, there are several electrical design requirements that must be determined.
Posted in: Briefs, Aerospace, Batteries, Electronics, Power Management, Power Supplies, Energy, Energy Efficiency, Energy Harvesting, Energy Storage, Mechanical Components, MEMs, Motion Control, Motors & Drives, Semiconductors & ICs, Sensors
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Heterogeneous Integration Technology

Integrating different types of devices and materials could increase their functional density, improving the performance of electro-optic systems for sensor applications.
Posted in: Briefs, Aerospace, Machinery, MEMs, RF & Microwave Electronics, Semiconductors & ICs, Sensors
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Molecular Engineering for Mechanically Resilient and Stretchable Electronic Polymers and Composites

The ability to predict the mechanical properties of organic semiconductors is of critical importance for roll-to-roll production and thermomechanical reliability of organic electronic devices. This research describes the use of coarse-grained molecular dynamics simulations to predict the density, tensile modulus, Poisson ratio, and glass transition temperature for poly(3-hexylthiophene) (P3HT) and its blend with C60. In particular, it is shown that the resolution of the coarse-grained model has a strong effect on the predicted properties.

Posted in: Briefs, Aerospace, Defense, Electronic Components, Electronics, Electronics & Computers, Composites, Materials, Mechanical Components, Semiconductors & ICs
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Electrodeposition of Metal Matrix Composites and Materials Characterization for Thin-Film Solar Cells

Metal matrix composites can electrically bridge the cracks that appear in semiconductor substrates and the composite grid lines.
Posted in: Briefs, Aerospace, Solar Power, Composites, Materials, Metals, Mechanical Components, Semiconductors & ICs
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S-Band Radar Systems

Artillery in the wrong hands pose an increased risk to the safety of U.S. service members, allies and civilians.
Posted in: Application Briefs, Defense, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, RF & Microwave Electronics, Semiconductors & ICs
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Tips for Reducing Error When Using Eddy Current Measuring Techniques

Inductive eddy current technology is an extremely versatile non-contact method for measuring an object's position, distance, or vibration.
Posted in: Articles, Aerospace, Defense, Metals, Semiconductors & ICs, Instrumentation, Measuring Instruments, Metrology, Monitoring, Test & Measurement, Testing Procedures
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Shape-Shifting Origami Could Help Antenna Systems Adapt On-the-Fly

Conventional reconfigurable electrical and radio frequency (RF) structures commonly used in applications involving real-time reconfigurability in response to fast varying operational scenarios require specialized substrates or complex electrical circuits. Origami-based RF reconfigurable components and modules offer a solution with unique properties. First, they enable re-configurability over continuous-state ranges (as opposed to discrete states). Second, they do not require specialized mechanical support for multilayer frequency-selective surface structures. Moreover, deployable origami-based RF structures can achieve large surface re-configurability ratios from folded to unfolded states. Finally, these structures allow for independent control of multiple figures of merit: bandwidth, frequency of operation, and angle of incidence.

Posted in: Articles, Aerospace, Communications, Defense, Electronic Components, Electronics, Electronics & Computers, Energy, Energy Harvesting, 3 D Printing & Additive Manufacturing, Manufacturing & Prototyping, Antennas, RF & Microwave Electronics, Semiconductors & ICs, Sensors
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Operational Considerations for High-Reliability Interconnects in Military and Aerospace Applications

In the recent past, military acquisition has shifted from being locked into large long-term contracts to developing complex systems in discrete increments that can be further optimized in future design cycles. These shorter design cycles allow for equipment to be deployed more rapidly, thereby mitigating the risk of subsystems going obsolete as increasing proportions of budget dollars go towards operation and support (O&S). This transition to evolutionary acquisition (EA) leaves a major opportunity for vendors to develop commercial off-the-shelf (COTS) components that are military-compliant.

Posted in: Articles, Aerospace, Manufacturing & Prototyping, Fastening, Joining & Assembly, Mechanical Components, RF & Microwave Electronics, Semiconductors & ICs, Test & Measurement
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