MEMs

VME64x PowerPC Single Board Computer

Cornet Technology Inc. (Springfield, VA) has announced its latest VME64x PowerPC single board computer called the Celero CVME-7448ST. This board incorporates a newer hostbridge controller (Tundra Tsi109) and DDR2 memory technology. The CVME- 7448ST offers higher performance per watt and improved signal integrity. Memory latency caused by pipeline blockage is eliminated, improving performance by up to 9% and overall power consumption is reduced by up to 6W over boards using older technology.

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VMEbus Single Board Computer

Dynatem (Mission Viejo, CA) offers the Intel® Core-Duo (Yonah) processor-based DPD VMEbus Single Board Computer (SBC). The DPD is a single-slot VMEbus (and VME64) compatible platform and requires only 5V from the backplane, enabling full functionality in legacy VMEbus backplane systems. All major components including processor, chipset, and memory are BGA based. The DPD is an IEEE 1101.2-compliant, conduction-cooled VMEbus module with wedge locks and full-board heat sink for high shock/vibration environments and temperature extremes.

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Center Probe Test Sockets

The new line of high-frequency center probe test sockets from Aries Electronics (Frenchtown, NJ) can be used with devices requiring pitches as low as 0.40mm. The sockets are used in CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices with speeds from 1 GHz to over 10 GHz.

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1000-Watt Power Supply

Lambda (San Diego, CA) has introduced the HWS1000 series of 1000-watt power supplies. The single-output power supplies are ideal for powering process control equipment, ATE, and factory automation systems. The power supplies meet the SEMI F4 power line sag specs. The units are available in 10 nominal output voltages including: 3.3, 5, 6, 7.5, 12, 15, 24, 36, 48, and 60-volts. Most models can be adjusted up to ±20% of nominal voltage to accommodate non-standard system voltages. The 7 through 60-volt models have a peak power rating of up to 1200-watts when operated with a line voltage of 200VAC or higher.

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System in Package Designs

System in Package (SiP) designs from Endicott Interconnect Technologies (Endicott, NY) bring multiple packages from a printed wiring board (PWB) into a SiP for improved electrical performance, and reduced PWB complexity and cost.

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Networking System-on-Chip Coprocessors

Lantronix (Irvine, CA) has introduced the DeviceLinx™ XChip™ family of fully turnkey, networking coprocessor system-on-chip (SoC) solutions. The SoC family enables original equipment manufacturers (OEMs) to embed serial-to-Ethernet connectivity and web services into a new class of high-volume, price-sensitive products that can be remotely managed over the Internet. The XChip is a highly-integrated, x86 class processor that includes a built-in Ethernet MAC and 10-100 PHY, 256 KB zero wait-state SRAM, up to 11 GPIOs, and a high-performance serial UART.

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Encrypted EEPROMs

Amtel® Corporation (San Jose, CA) offers the CryptoMemory® family of EEPROMs with a 64-bit embedded hardware encryption engine, four sets of non-readable 64-bit authentication keys, and four sets of non-readable 64-bit session encryption keys. The new devices provide a low-cost means of preventing product counterfeiting and/or piracy.

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64-Bit Single Board Computer

MEN Micro Inc. (Boston, MA) has expanded its series of intercompatible CompactPCI/-Express single board computers (SBCs) with a new 64-bit board based on the Intel® Core™2 Duo Processor T7500 combined with the Mobile Intel 965GM Express Chipset. The new F18 SBC is ideal for industrial applications such as monitoring, visualization, or control computers, as well as applications in test and measurement. With specially developed heat sink and soldered components to protect against shock and vibration, the F18 is equipped for use in mobile applications as well.

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Z-RAM

In the electronics industry today there are two commonly used high-speed memory types: static RAM (SRAM) and dynamic RAM (DRAM). Traditionally, SRAM embedded memory has been the designer's choice for fast memory, but since a typical SRAM bitcell is comprised of six transistors, that benefit comes at the expense of cost and silicon area. Embedded DRAM (eDRAM), whose smaller bitcell is comprised of a single transistor and single capacitor, offers a much lower cost option, but has higher latency and is typically used further from the processor. While DRAM is fundamental to electronic systems, it does have its limit — namely, its inability to scale to accommodate the migration to smaller, and therefore more advanced, process geometries. This limitation is further complicated by the fact that new application areas for memory are fast appearing, fueled by the popularity of digital home appliances and next-generation mobile devices, the digital convergence of electronic goods and telecommunications, and ever evolving media content.

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Designing Configurable Air Transport Racks

High-powered embedded computing equipment utilizing the Air Transport Rack (ATR) form factor is playing an ever-larger role in extreme, mission-critical applications in air, land, and sea environments. This compact, rugged, and light form factor has been around for nearly 70 years. Its small size meets the tight space constraints of the current generation of military grade equipment, and its flexibility, coupled with the proliferation of commercial off-the-shelf (COTS) components, allows ATR-based systems to meet cost and upgradeability goals for both legacy and emerging systems.

Posted in: Articles, Articles, Electronics & Computers, Avionics, Materials handling
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