MEMs

Aerospace Engine Components

Sandvik Coromant (Fairlawn, NJ) has released an Aerospace Engine Solutions Package that contains five standard products to support the aerospace engine industry. The GC1115 is a PVD-coated grade for high-temperature alloys that offers wear resistance; the CoroCut angled inserts are a grooving system that uses 24 standard articles in grade GC1115 to provide access to complex features in disc, shaft, and casing manufacturing; and the SL70 modular serration lock and oval blade coupling combines with Coromant Capto to provide accessibility and stability. The carbide solutions come equipped with high-pressure coolant nozzles and are available for CoroCut, ceramic RCGX, and carbide RCMT.

The other two products are the CoroMill Plura conical ball nose end mills, which are 12 standard articles with radii and taper options for the 5-axis machining of titanium blisk and impeller turbo parts; and the CoroMill 316 solid carbide with exchangeable head coupling that has diameter and radii options for features such as scallop milling on discs, casings, and shafts.

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Thermal Wind Tunnel

OMEGA Engineering (Stamford, CT) offers the WT-2000 thermal wind tunnel in a portable, benchtop design. Made of clear polycarbonate and PVC, it is designed to provide uniform and repeatable airflow up to 1000 fpm. The control box allows for open-loop, full-scale operation of individual fans, groups of two fans, or all fans at once. The large test chamber with a hinged access door and access panel allows for comparison testing or different size heat sinks and circuit boards. The unit is CE compliant.

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Robotic Platform

The Chaos™ robotic platform from Auton - omous Solutions (Logan, UT) is designed to remotely access hazardous areas previously accessible only by foot, reducing risk to personnel. The robot is able to navigate over rough, steep, and loose terrain with four independent drive tracks that can continuously change orientation a full 360 degrees. It can alter its pitch, roll, and yaw to navigate surfaces too uneven for other tracked platforms.

The robot features a high payload capacity and an available manipulator arm with a 50-pound capacity at full reach of 72". Its low base weight allows it to be lifted out of a vehicle and deployed by two people. As a JAUS-compatible platform, the robot allows addition of a variety of sensors and other robotic payloads.

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Air-Cooled Enclosures

Carlo Gavazzi Computing Solutions (Brockton, MA) has introduced the 715 Series of recirculating, air-cooled, rugged ATR enclosures for protection of commercial off-the-shelf convection-cooled cards de ployed in caustic environments. The enclosures withstand extremes in temperature, vibration, humidity, and contaminants. The cooling system uses a recirculating fan on the inside to transfer circuit card heat energy to the conducting walls. The walls are engineered thermal cores that provide heat transfer to the exterior surfaces of the system. The enclosures feature a brazed aluminum frame construction and are available with scalable power options for a variety of airborne and vehicle applications.

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Aerospace Seals

Trelleborg Sealing Solutions (Fort Wayne, IN) has introduced Turcon® Varilip® PDR industrial seals for the aerospace industry. They are designed for high-speed rotating applications, and are constructed from one or multiple PTFE-based sealing elements, which are mechanically retained in a precision-machined metal body. The metal body provides a static seal against the housing, preventing thermal cycling. The Turcon sealing element provides positive dynamic sealing on the shaft at high rotary speeds.

The seals reduce temperature generation, permit higher peripheral speeds, and lower power consumption. The seals offer a choice of standard parts in various corrosion-resistant materials and lip geometries.

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Increasing System Flexibility Using FPGAs

The proliferation of FPGAs into the embedded computing industry has opened up many new pathways for designers to design cost-effective systems that will withstand technology upgrades, changes in application requirements, and requests for low volumes for system components. Because it allows a user to update functionality after the device has left the manufacturer, FPGA technology gives embedded designers the flexibility to configure both customized and standard products. They can rethink the way systems are constructed and build ones that significantly advance existing technologies and blaze new paths for cutting-edge embedded systems.

Posted in: Articles, Articles, Electronics & Computers, Embedded software, Integrated circuits, Cost analysis
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StackableUSB™ Adapting PC Technology to the Embedded Market

Embedded systems and desktop PC's have had a love hate relationship over the years. The PC has been the source of significant technological advances that have enabled embedded systems to evolve to their current levels of sophistication, using the faster processors and highly-integrated functionality of the CPU cores available today. Additionally, the PC world has also spun off I/O buses, both serial and parallel, that have enabled embedded systems designers to expand and configure their system I/O. On the other hand, the embedded industry has often been wary to adopt PC technology due to the short life cycle some PC technologies experience.

Posted in: Articles, Articles, Electronics & Computers, Design processes, Architecture, Embedded software, Performance upgrades
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Using Virtualization to Secure Mobile Device Designs

Mobile devices are increasingly coming under attack from malicious applications. As more complex operating systems (OS), such as Symbian, Windows Mobile, and Linux are used in handsets, providing security updates and identifying new vulnerabilities has become more complicated. Addition ally, frequent patching and rewriting of code to keep one step ahead of hackers undermines the utility and longevity of legacy software. What developers really need is an environment that is inherently safe from attack and provides the appropriate level of security for all code running in the target device. Secure, segregated areas for critical code must be combined with secure communications in order to provide protection for mobile devices.

Posted in: Articles, Articles, Electronics & Computers, Communication protocols, Cyber security
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Real-Time Data Distribution for Industrial Automation Systems

The quest to bring lockstep efficiency to labor intensive factory production at first relied on mechanical ingenuity. Over time, as reliable and cost-effective microprocessor technology became available, assembly lines were retooled to use the new electronics to achieve greater automation and productivity. Today, pervasive network technology, including the Internet, is bringing about another evolutionary change in industrial automation. No longer is it sufficient for individual machines to perform their specific tasks independently. Instead, individual parts of a larger process must be aware of each other; they must exchange data in realtime, and adapt to changes in the process or environment. Additionally, it is increasingly necessary to exchange data outside of the traditional industrial network and beyond the factory floor, and to include enterprise LANs and the Internet. Up-tothe- minute information on manufacturing processes needs to be available to analysts, inventory managers, and others within the office environment.

Posted in: Application Briefs, Application Briefs, Electronics & Computers, Data exchange, Automation, Production, Industrial vehicles and equipment
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3D Stacked IC Technology (Esc Booth # 1535)

IMEC (Leuven, Belgium) has announced significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5μm Cu through-silicon vias (TSV). The 3D stacked integrated circuits will be further developed on 200mm and 300mm wafers, integrating test circuits from participating partners. The dies were realized on 200mm wafers in IMEC's reference 0.13μm CMOS process with an added Cu-TSVs process. For stacking, the top die was thinned down to 25μm and bonded to the landing die by Cu-Cu thermocompression.

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