MEMs

Low-Power Distributed Jammer Network

The Distributed Jammer Network (DJN) is composed of a large number of tiny, low-power jammers, which are distributed inside a target network and emit radio energy to disrupt its communications. Recent advancement in microelectromechanical system (MEMS) technology makes it possible to make jammers sufficiently small that a DJN can take the form of a dust suspending in the air, thus the name Jamming Dust. Miniaturization of jammers should be less challenging than that of wireless sensors since jammers just emit noise signal without requiring complex modulation, filtering, and other signal processing functions. Therefore, new miniature devices such as nanotube radio may find their first application in jamming dust.

Posted in: Briefs, Electronics & Computers, Microelectricmechanical device, Radio equipment, Telecommunications
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Fundamentals of Metamaterials for High-Power RF Applications

Recent years have seen a burgeoning interest in the physics and applications of metamaterials. Briefly, metamaterials consist of a periodic array of subwavelength structures that produce an electromagnetic response not typically available in nature. Notably, composites of these structures in general exhibit both frequency and spatial dispersion, leading to a rich variety of physical phenomena such as backward wave propagation and a negative refractive index.

Posted in: Briefs, Electronics & Computers, Electromagnetic compatibility, Radio equipment, Composite materials, Materials properties
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Thermal Analysis and Microhardness Mapping in Hybrid Laser Welds in a Structural Steel

The concept of combining a laser welding system with a conventional arc welding system (GTAW) was first proposed in order to improve the stability of the laser welding system and to allow greater flexibility in part fit-up. Prior research stated that using a YAG laser at a power of 3 kW, one was able to hybrid laser weld a 4-mm-thick aluminum alloy at a speed of 4 n/min. For a mild steel plate, butt welding at 1 m/min with 5 kW of 6-mm-thick plate was realized. Just as significantly as the weld speed was the ability to hybrid laser weld with gaps up to 1.5 mm in a plate 6 mm thick. The glass metal arc welding (GMAW) laser hybrid process can increase the gap bridging ability, i.e., it appreciably broadens the range of tolerances with regard to edge preparation quality. The arc’s energy input in the hybrid welding process also permits control of the cooling conditions. Via the keyhole, the laser beam brings about easier ignition of the arc, stabilization of the arc welding process, and penetration of the energy deep into the material. The improvement of the energy input leads to a greater welding depth and speed being achieved with the hybrid process compared with individual processes on their own.

Posted in: Briefs, Mechanical Components, Lasers, Welding, Steel, Thermal testing
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Encapsulated Ball Bearings for Rotary Micro Machines

Microelectromechanical systems (MEMS)-fabricated silicon rotary elements for micro-motors, micro-generators, and micro-turbomachinery have received growing attention with applications in power conversion and actuation. Within these technologies, the bearing mechanism is the primary determinant of device performance and reliability. Active bearings, such as magnetic or electrostatic, have the advantage of being controlled during the operation, but at the cost of the accompanying circuitry. Passive bearings span a large range of velocities that include center-pin bushings with low revolution rates possible, and hydrostatic or hydrodynamic bearings with high revolution rates possible.

Posted in: Briefs, Mechanical Components, Microelectricmechanical device, Bearings
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Open-Frame Panel PC

WinSystems (Arlington, TX) introduced a 12.1-inch open-frame, color flat panel PC and 1.66GHz single board computer (SBC) based on the Intel® Atom™ processor. The PPC3-12 panel PC is a compact, ready-to-mount flat panel display subsystem that also includes a resistive touchscreen integrated into a chassis less than three inches deep. The PPC3-12 is shipped with a wired Ethernet connection plus expansion option for 802.11 wireless Ethernet and/or CDMA/GSM cellular modems. A high-luminance, wide-viewing angle, 12.1-inch diagonal color TFT with replaceable LED backlight is the foundation of the Panel PC. It supports XGA 1024 x 768 pixels that can display 16.2M (8-bit RGB) or 262,144 (6-bit RGB) colors. WinSystems offers a single core 1.66GHz N455 and dual core 1.8GHz D525 version of the SBC to serve as the computing and display engine for the Panel PC. Both SBCs are based on the Intel® Atom™ processor family with a full set of I/O interfaces including two Gigabit Ethernet ports, VGA and dual channel LVDS flat panel video, miniPCI connector to support wireless networking modules, eight USB 2.0 ports, four serial COM ports, 48 digital I/O lines, audio, LPT and PS/2 port for keyboard and mouse.

Posted in: Products, Products, Electronics & Computers
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XMC Module

Acromag’s (Wixom, MI) new XMC-6VLX mezzanine modules feature a configurable Xilinx® Virtex™-6 FPGA enhanced with multiple high-speed memory buffers, I/O, and numerous high-bandwidth serial interfaces. The FPGA provides rapid processing and is closely coupled to the serial interconnects to prevent data transfer bottlenecks. 10-Gigabit Ethernet, PCI Express, Serial RapidIO, and Xilinx Aurora implementations are supported. Optional front-panel I/O adds dual SFP ports for Fibre Channel or copper Gigabit Ethernet and a VHDCR connector for expanded I/O signal access. Build options include the choice of a Xilinx XC6LX240T or XC6LX365T FPGA device and additional front-panel I/O connectors. Base models are ready for use in air-cooled or conduction-cooled systems.

Posted in: Products, Products, Electronics & Computers
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Video and Audio Capture Card

WinSystems (Arlington, TX) introduced a 12.1-inch open-frame, color flat panel PC and 1.66GHz single board computer (SBC) based on the Intel® Atom™ processor. The PPC3-12 panel PC is a compact, ready-to-mount flat panel display subsystem that also includes a resistive touchscreen integrated into a chassis less than three inches deep. The PPC3-12 is shipped with a wired Ethernet connection plus expansion option for 802.11 wireless Ethernet and/or CDMA/GSM cellular modems. A high-luminance, wide-viewing angle, 12.1-inch diagonal color TFT with replaceable LED backlight is the foundation of the Panel PC. It supports XGA 1024 x 768 pixels that can display 16.2M (8-bit RGB) or 262,144 (6-bit RGB) colors. WinSystems offers a single core 1.66GHz N455 and dual core 1.8GHz D525 version of the SBC to serve as the computing and display engine for the Panel PC. Both SBCs are based on the Intel® Atom™ processor family with a full set of I/O interfaces including two Gigabit Ethernet ports, VGA and dual channel LVDS flat panel video, miniPCI connector to support wireless networking modules, eight USB 2.0 ports, four serial COM ports, 48 digital I/O lines, audio, LPT and PS/2 port for keyboard and mouse.

Posted in: Products, Products, Electronics & Computers
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Accelerated Processing Unit

The AMD (Sunnyvale, CA) Embedded G-Series processor is the world’s first integrated circuit to combine a low-power CPU and a discrete-level GPU into a single embedded Accelerated Processing Unit (APU). The AMD G-T16R APU, with an average power of only 2.3 Watts, enables very small form factor, fan-less and portable applications. APU configurations are available with single or dual x86 cores, at 4.5W, 9W or 18W thermal design power (TDP), and two levels of graphics and video performance. Each APU supports single or dual- independent high resolution displays and exceptional multi-media capability with hardware decode support for H.264, VC-1, MPEG2, WMV, DivX and Adobe® Flash. When paired with the AMD A50M controller hub with support for advanced interfaces such as 6Gb/s SATA, Generation 2 PCI Express®, and HD Audio, the AMD G-Series platform delivers a low power, value-oriented solution for applications requiring a better balance of CPU and multimedia performance.

Posted in: Products, Products, Electronics & Computers
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VPX: The State of the Ecosystem

You can never have too much bandwidth. High-speed processing and growing amounts of data to be communicated require generous bandwidth from the board level to the I/O. VPX, with a backplane connector system supporting 6.25 Gb/s in a switched fabric architecture, is the latest generation of VMEbus and offers new levels of performance for embedded computer systems. VPX systems are designed for flexible application of demanding highspeed protocols, such as 10G Ethernet, RapidIO, InfiniBand, and Hyper Transport protocols, in ground, aerospace, and marine applications.

Posted in: Articles, Articles, Electronics & Computers, Architecture, Data exchange, Performance upgrades
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Thin Cavity Cooling of Electronic Circuitry

Anovel tested technology for cooling electronic circuitry is also useful in many other industries. The method is called “Thin Cavity Fluidic Heat Exchanger”(TCFHE). Technology details can be viewed at the U.S. Patent and Trademark Web site, at application 20100078155.

Posted in: Articles, Articles, Electronics & Computers, Electronic equipment, Product development, Cooling
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