Electronics & Computers

Maintaining Enterprise Resiliency Via Kaleidoscopic Adaption and Transformation of Software Services (MEERKATS)

This research investigates a new vision for increasing the resilience of computing clouds by elevating continuous change, evolution, and misinformation as first-rate design principles of the cloud's infrastructure. The work is motivated by the fact that today's clouds are very static, uniform, and predictable, allowing attackers who identify a vulnerability in one of the services or infrastructure components to spread their effect to other, mission-critical services. The goal is to integrate into clouds a new level of unpredictability for both their services and data so as to both impede an adversary's ability to achieve an initial system compromise and, if a compromise occurs, to detect, disrupt, and/or otherwise impede their ability to exploit this success.

Posted in: Briefs, Aerospace, Data Acquisition, Defense, Computers, Electronic Components, Electronics & Computers, Software

Compact Power Amplifier Solution for Electronic Warfare

Wolfspeed, a Cree company, provides field-tested silicon carbide (SiC) and gallium nitride (GaN) power and RF solutions. As a leader in wide-bandgap semiconductor technology, Wolfspeed partners with designers to build faster, smaller, lighter, and more powerful electronic systems.

Posted in: Articles, Aerospace, Defense, Board-Level Electronics, Power Management, Power Supplies, Materials, Machinery, Mechanical Components, Power, Power Transmission, RF & Microwave Electronics, Semiconductors & ICs

Bringing RF into the Embedded World: It's Time

Embedded systems have been almost entirely digital throughout their long history, while RF and microwave technologies were separate subsystems with no effective interface between the two. For many reasons, this “RF/digital divide” should finally be connected.

Posted in: Articles, Aerospace, Defense, Board-Level Electronics, Computers, Electronic Components, Electronics, Electronics & Computers, RF & Microwave Electronics

New Products: October 2018 Aerospace & Defense Technology

Microstepping Motor Driver

US Digital (Vancouver, WA) announced the release of the MD3 Programmable Microstepping Motor Driver, capable of driving motors from NEMA size 14 to 42. The MD3 accepts 9-50 VDC power inputs and is rated for currents up to 7A continuous duty. In addition to digital input controls, the MD3 can be configured and controlled using the open MODBUS RTU protocol over a RS485 bus. A GUI application is supplied that allows many settings to be changed including the number of microsteps per full step, acceleration/deceleration rates, speed and current cutback. The design supports multiple MD3 units on the same RS485 bus and allows for programmable motion profiles. In addition, the MD3 has a brushed DC motor speed control mode.

Posted in: Products, Aeronautics, Aerospace, Data Acquisition, Board-Level Electronics, Computers, Electronic Components, Electronics, Electronics & Computers, Power Management, Motion Control, Motors & Drives, Positioning Equipment, Power, RF & Microwave Electronics, Data Acquisition

Integrated Magneto-Optical Devices for On-Chip Photonic Systems

The magneto-optical (MO) oxide layer consists of (Bi,Y)3Fe5O12 or BiYIG, bismuth garnet. This material was selected because it has a better figure of merit than the CeYIG previously used, especially at lower wavelengths (1310 nm vs. 1550 nm). A top-down deposition process was developed in which BiYIG/YIG stacks are grown on the Si waveguide with YIG on top. The stack is annealed at 800°C/5 min to crystallize both layers, with the YIG templating the BiYIG leading to garnet phases rather than other oxides, and the BiYIG is directly on the Si waveguide. Initial attempts led to a film with Bi oxide phases, because the Bi was in excess and could not escape during the anneal as occurs in Si/YIG/BiYIG stacks. Hence the composition was adjusted to include slightly more Fe, which yielded films with only garnet peaks.

Posted in: Briefs, Aeronautics, Aerospace, Aviation, Electronic Components, Electronics, Electronics & Computers, Manufacturing & Prototyping, Materials, Optical Components, Optics, Photonics, Semiconductors & ICs

Low Power Optical Phase Array Using Graphene on Silicon Photonics

Despite enormous advances in integrated photonics over the last decade, an efficient integrated phase delay remains to be demonstrated. This problem is fundamental – most monolithic thin film deposition relies on centro symmetric materials (such as silicon, silicon dioxide, silicon nitride), which by definition do not have an electro-optic effect. Such materials have been shown to be excellent transparent materials, however they are either optically passive, or rely on very small plasma dispersion effect or power-hungry thermo-optic effect for tunability. These phase change materials have losses associated due to heating or carrier injection in the waveguides. This research shows that graphene can be used to provide electro-optic properties to traditionally passive optical materials.

Posted in: Briefs, Aerospace, Electronic Components, Electronics, Electronics & Computers, Materials, Optical Components, Optics, Photonics

New Products: September 2018 Aerospace & Defense Technology

Pin Fin Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) (Norwood, MA) has a family of Pin Fin heat sinks designed as cost-effective solutions for systems with adequate airflow. The high aspect ratio design enables ATS Pin Fin heat sinks to provide low thermal resistance from base to fins in systems where the airflow measures 200-plus LFM (linear feet per minute). The cross-cut design also allows the Pin Fin heat sinks to be effective in systems where airflow is ambiguous.

Posted in: Products, Aeronautics, Aerospace, Aviation, Data Acquisition, Thermal Management, RF & Microwave Electronics, Data Acquisition, Detectors, Sensors, Software, Instrumentation, Measuring Instruments, Monitoring, Test & Measurement

High-Performance Computing for the Next-Generation Combat Vehicle

The development of the Next-Generation Combat Vehicle (NGCV) will require technological advancements in many areas, including lethality, protection, autonomy, human–agent teaming, and electromagnetic capabilities. What ties all of these future capabilities together is the need for vast computational resources to support the artificial intelligence (AI) implicit in bringing these advancements to the battlefield. The operating environment of the NGCV will be such that communications will be severely limited, if available at all; systems will be under constant cyber-attack; and adversarial AI may be actively attempting to deceive all sensors — all occurring under severe size, weight, power, and time-available constraints. These factors, and more, are the motivation for developing a strategy of mobile High-Performance Computing (HPC) for the NGCV.

Posted in: Articles, Aerospace, Automotive, Communications, Computers, Video, RF & Microwave Electronics, Data Acquisition, Sensors

Merging Antenna and Electronics Boosts Energy and Spectrum Efficiency

By integrating the design of antennas and electronics, researchers from the Georgia Institute of Technology have boosted the energy and spectrum efficiency for a new class of millimeter-wave transmitters, allowing improved modulation and reduced generation of waste heat.

Posted in: Articles, Aerospace, Electronics, Electronics & Computers, Energy, Energy Efficiency, Smart Grid, Antennas, RF & Microwave Electronics, Semiconductors & ICs

Using Thermoplastics in Aerospace Applications

In August 2017, Qantas Airlines laid down the challenge to both Boeing and Airbus to offer an aircraft that can cross one of aviation's “last frontiers.” That “last frontier” was an aircraft capable of flying an economical passenger load non-stop for over 20 hours. This would allow Qantas to offer direct service from Sydney to London or New York. Weight reduction through the use of thermoplastics and other technologies would be the key to any chance of success in this endeavor.

Posted in: Articles, Aeronautics, Aerospace, Aviation, Thermal Management, Manufacturing & Prototyping, Composites, Materials, Metals, Plastics, Data Acquisition, Sensors