Electronics & Computers

3D Printed Spacecraft Parts

Stratasys Ltd.
Eden Prairie, MN
952-937-3000
www.stratasys.com/aerospace
Phoenix Analysis and Design
Technologies (PADT) Tempe, AZ
1-800-293-PADT
www.padtinc.com

Stratasys Ltd., a company that specializes in applied additive technology solutions, and Phoenix Analysis & Design Technologies, Inc. (PADT) have teamed up with Lockheed Martin Space to deliver next-generation 3D printed parts for NASA's Orion deep-space spacecraft. Key to the project are Stratasys advanced materials – including an ESD variant of the new Antero™ 800NA, a PEKK-based thermoplastic offering high performance mechanical, chemical, and thermal properties.

Posted in: Application Briefs, Aerospace, Defense, Thermal Management, 3 D Printing & Additive Manufacturing, Manufacturing & Prototyping, Materials, Plastics
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Beyond VMEbus A New Concept

Deployability and life-cycle management of large and disparate collections of weapons, combat and C4ISR computing systems is one of the most critical challenges facing the Department of Defense today. Numerous defense programs, each defining separate, and oftentimes unique system architectures, configurations, and compositions, result in a wide range of processing and control systems that create complexity and drive excessive lifecycle costs.

Posted in: Articles, Aerospace, Defense, Electronics & Computers
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Taming the Thermal Behavior of Solid-State Military Lasers

Laser diodes and laser diode arrays (LDAs) are widely used throughout military systems, for sighting and range finding, but also at high power levels as offensive and defensive weapons. In companion with much higher-power chemical lasers, these high-power optical sources can generate kilowatts of optical power (as arrays) for use in neutralizing incoming missiles, rockets, and armaments and for long-distance offensive strikes. But laser diodes are also still inefficient, and a great deal of the energy supplied to a laser diode or an LDA is converted into heat, which must be safely dissipated to ensure a long operating lifetime for the solid-state devices.

Posted in: Articles, Aerospace, Board-Level Electronics, Electronics & Computers, Power Management, Thermal Management, Ceramics, Materials, Metals, Packaging, Lasers & Laser Systems, Optics, Photonics, Semiconductors & ICs
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Surviving the Challenge of Thermal Design in Aerospace Electronics

The aerospace sector places some uniquely challenging demands on electronics designers. For a start, the environments that the electronics are exposed to are much harsher than in almost every other scenario. Moreover, the life expectancy of the products is much higher, while the accepted failure rate is easily an order of magnitude lower than typical commercial products.

Posted in: Articles, Aerospace, Defense, Electronics, Thermal Management, Computer-Aided Design (CAD), Simulation Software, Software
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Digital Radar Warning Receiver

Northrop Grumman Corporation
Falls Church, VA
703-280-2900
www.northropgrumman.com

Northrop Grumman Corporation recently received a $124.7 million award for production of AN/APR-39D(V)2 digital radar warning receiver and electronic warfare management systems. The award followed the successful completion of engineering and manufacturing development activities, including a series of rigorous tests that verified the system's readiness for production and the demands of combat operations.

Posted in: Application Briefs, Aerospace, Aviation, Defense, Electronics & Computers, Displays/Monitors/HMIs, Imaging, Antennas, RF & Microwave Electronics, Detectors, Sensors
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New Products: May 2018 Aerospace & Defense Technology

Rapid Deployment SIGINT Sensor

VStar Systems (San Diego, CA) announced the addition of a pod version of its MA-C SIGINT Sensor, the MA-C MiniPod™. Two active high frequency (HF) antennas allow for intercept and copy of land mobile radios from both direct Line of Sight (LOS) as well as Near Vertical Incidence Skywave (NVIS) signals for Beyond Line of Sight (BLOS) communication methods. The MA-C MiniPOD can be installed on most standard airborne racks/missile launchers for integration on a wide variety of platforms.

Posted in: Products, Board-Level Electronics, Computers, Electronic Components, Electronics, Electronics & Computers, Composites, Materials, Robotics, Sensors, Computer-Aided Manufacturing (CAM), Software, Instrumentation, Measuring Instruments, Monitoring, Test & Measurement
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New Technologies Tackle UAV Challenges

Unmanned vehicles for air, land, and water represent an increasingly-important capability for virtually all military services worldwide. Because each new generation of device technology promises capabilities and higher levels of overall performance for unmanned vehicles of all types, military customers expect these benefits in the latest UAV offerings. To meet these expectations, systems engineers must deal with increasingly difficult problems of thermal management, power budgeting, EMI emissions and susceptibility, weight, size, cabling, connectors, antenna management, and command/control functions. Several new technologies and innovative packaging concepts now provide better solutions to these issues.

Posted in: Articles, Aeronautics, Aerospace, Aviation, Communications, Wireless, Data Acquisition, Electronic Components, Electronics, Electronics & Computers, Thermal Management, RF & Microwave Electronics, Data Acquisition, Sensors, Software
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Protecting Critical Data on Unmanned Underwater Platforms

Emerging mission requirements from global defense forces are driving new programs and applications for Unmanned Underwater Vehicle (UUV) platforms. Like their airborne counterparts, UUVs are ideal for deploying Intelligence, Surveillance and Reconnaissance (ISR) mission payloads. To speed the development of these autonomous vehicles, system designers are turning to small form factor (SFF) Commercial off the Shelf (COTS) technologies previously proven in Unmanned Aerial System (UAS) deployments. These low-power SFF subsystems, including miniature network switches and mission computers, are ideal for use in UUVs for which any additional weight or power consumption can have significant detrimental effects on mission distance and duration. By selecting proven rugged COTS solutions, already tested and qualified to the extreme demands of MIL-STD-810G, MIL-STD-461, MIL-STD-704 and/ or RTCA/DO-160G standards for environmental, power, and EMI compliance, UUV system developers have found that they can greatly accelerate their program integration and reduce overall risk.

Posted in: Articles, Aerospace, Communications, Data Acquisition, Computers, Electronics & Computers, Data Acquisition, Sensors
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Educating UGVs

Advancements in the field of artificial intelligence (AI) are accelerating as the technology matures from being research-orientated to being deployed in a wide range of products and services, such as autonomous vehicles. While Convolutional Neural Networks (CNNs) were first described in the 1950s, the technology remained an academic concept until the availability of large training data sets and powerful Graphics Processor Units (GPUs), a processor architecture ideal for the heavy math computational demands associated with neural network processing. Once scientists had low-cost and high-performance platforms, the technology exploded for many commercial uses. Military use is more challenging due to the lack of large data sets, but that is changing too as areas including thermal imagery are starting to be used.

Posted in: Articles, Aeronautics, Aerospace, Aviation, Data Acquisition, Computers, Electronics & Computers, PCs/Portable Computers, Thermal Management, Imaging, Machine Vision, Visualization Software, Machinery, Data Acquisition
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Miniature Data Recorder

DTS
Seal Beach, CA
+1 562-493-0158
www.dtsweb.com

Harsh, wet and dusty environments pose serious reliability issues for data collection. The SLICE IP68 data acquisition system is designed to measure physical signals in challenging test environments. With an ultra-small footprint of only 60 mm x 60 mm, the system can be embedded in most test articles with size and mass constraints. Its compact size means that it can be placed near the point of interest, eliminating the need for long cable runs, waterproof enclosures, or slip rings.

Posted in: Application Briefs, Aeronautics, Aviation, Data Acquisition, Defense, Electronic Components, Electronics, Electronics & Computers, Data Acquisition, Sensors
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