Electronics & Computers

Thermoplastic Drive Shaft System Developed for Aerospace Applications

herone GmbH, (Dresden, Germany) recently won the prestigious 2019 JEC Innovation Awards, in the Aerospace application category. The winning application was the company's all-thermoplastic drive-shaft system overmolded with an integral gear, designed for use in aerospace applications.

Posted in: INSIDER, News, Aerospace, Defense, Thermal Management, Materials, Plastics, Joining & Assembly, Machinery, Mechanical Components, Motion Control, Motors & Drives, Positioning Equipment
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Thermoplastic Composites to Play Enhanced Role in Next-Generation Aerospace Applications

Advanced thermoplastic composites-and their emergence as prominent materials for future aerospace applications–are sparking a flurry of activity from aerospace manufacturers, designers, component producers and formatters.

Posted in: Articles, Aeronautics, Aerospace, Aviation, Thermal Management, Manufacturing & Prototyping, Composites, Materials, Plastics, Mechanical Components
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Naval Surveillance System

CONTROP Precision Technologies Ltd.
Hod Hasharon, Israel
+972-9-744-0661
www.controp.com

CONTROP Precision Technologies Ltd., a company that specializies in electro-optics (EO) and infrared (IR) defense and homeland security solutions, has provided the Latvian Navy with the iSea-30HD system to enhance their maritime surveillance capabilities. The system was designed for various maritime vessels and is already in operational use by the Latvian Navy, as well as other navies worldwide.

Posted in: Application Briefs, Defense, Electronic Components, Electronics, Electronics & Computers, Cameras, Imaging, Video, Lasers & Laser Systems, Optical Components, Optics, Photonics
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Understanding the “Black Art” of RF and Microwave Switching

Understanding RF, especially microwave switching, can be a challenge. In many cases, test systems have been compromised because a test engineer did not consider all the components of their test system: instruments, switching, cabling, Mass Interconnect (test fixture interface), fixture design, and so on. Each component has its own set of characteristics. With RF and microwave components, effects including insertion loss, VSWR, bandwidth, and so on all need to be considered as well.

Posted in: Articles, Aerospace, Electronic Components, Electronics, Electronics & Computers, Joining & Assembly, Mechanical Components, RF & Microwave Electronics, Instrumentation, Measuring Instruments, Test & Measurement
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A New Approach to Satellite Communications

In the Heinrich Hertz satellite mission, which will be launched in 2020, the DLR Space Administration (German Aerospace Center) plans to develop and operate a German communications satellite. The chief objective of the mission is the scientific validation and testing of payload technologies in space.

Posted in: Articles, Aerospace, Communications, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, Imaging, Antennas
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New Products: April 2019 Aerospace & Defense Technology

Ruggedized Software Defined Radio Solutions

Pixus Technologies (Waterloo, Ontario) has developed ruggedized versions of commercial software defined radios. The RX310, the first in the series of small form factor ruggedized devices, utilizes the USRP software defined radios from Ettus Research, a National Instruments brand. The weatherproof enclosure features IP67 sealing for water and dust ingress. It is also designed for MIL-STD-810 for shock/vibration and MIL-STD-461 for EMI. The RX310 contains two extended bandwidth daughterboard slots covering 10 MHz – 6 GHz with up to 160 MHz of baseband bandwidth, dual 1/10 GigE high-speed interfaces, and a large user-programmable Kintex-7 FPGA. The unit is 302mm wide × 400mm long × 98mm tall with conduction-cooled fins for heat dissipation.

Posted in: Products, Board-Level Electronics, Computers, Electronic Components, Electronics, Power Management, Power Supplies, Mechanical Components, Power, RF & Microwave Electronics, Data Acquisition, Sensors, Software
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Northrop Grumman Receives Contract for Next-Generation Navigation System

The U.S. Air Force has awarded Northrop Grumman Corporation a $59 million contract for the engineering and manufacturing development (EMD) phase of the Embedded Global Positioning System (GPS) /Inertial Navigation System (INS)-Modernization, or EGI-M, technology.

Posted in: INSIDER, News, Aerospace, Aviation, Communications, Wireless, Defense, Electronics, RF & Microwave Electronics
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Friendly Electromagnetic Pulse Improves Survival for Electronics

An electromagnetic pulse (EMP) emitted by a nuclear weapon exploded high above the United States could disable the electronic circuits of many devices vital to military defense and modern living. These could include complicated weapon systems as well as phones, laptops, credit cards and car computers. Also in trouble might be home appliances, gas station pumps and bank accounts.

Posted in: INSIDER, News, Defense, Electronic Components, Electronics, Energy, Test & Measurement
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New Products: February 2019 Aerospace & Defense Technology

Defense-Grade FPGAs

Xilinx, Inc. (San Jose, CA) announced availability of its Defense-grade XQ UltraScale+ portfolio of products, providing the benefits of its UltraScale+ architecture plus extended temperature and ruggedized packages to address the needs of the aerospace and defense industry. The new products encompass the XQ Zynq® UltraScale+ MPSoCs and RFSoCs, as well as XQ Ultra-Scale+ Kintex® and Virtex ® FPGAs.

Posted in: Products, Data Acquisition, Computers, 3 D Printing & Additive Manufacturing, Industrial Controls & Automation, Manufacturing & Prototyping, Composites, Materials, Joining & Assembly, Machinery, Mechanical Components, Automation, Computer-Aided Design (CAD), Software, Measuring Instruments, Test & Measurement
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An Introduction to PCM Heat Sinks

With the exception of thermal storage heat sinks, the term heat sink is a misnomer. Standard heat sinks for electronics cooling are actually heat exchangers, taking the heat from the electronics, and transferring it to a fluid, either air or coolant. Phase Change Material (PCM) heat sinks are the only heat sinks that actually act as a (temporary) sink for heat. They are emerging in the thermal management realm to solve thermal problems in systems where active solutions cannot be used. When there is no place to dissipate the heat generated by electric components, a PCM heat sink is capable of absorbing the generated waste heat [1] .

Posted in: Articles, Aerospace, Electronic Components, Electronics, Electronics & Computers, Thermal Management, Manufacturing & Prototyping, Materials
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