Electronics & Computers

Putting FPGAs to Work in Software Radio Systems

FPGAs have become an increasingly important resource for software radio systems. Programmable logic technology now offers significant advantages for implementing software radio functions such as DDCs (Digital Downconverters). Over the past few years, the functions associated with DDCs have seen a shift from being delivered in ASICs (Application-Specific ICs) to operating as IP (Intellectual Property) in FPGAs.

Posted in: White Papers, White Papers, Data Acquisition, Defense, Electronics & Computers
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New Products: December 2019 Aerospace & Defense Technology

Metal 3D Printers, Dispensing Robots, Resistance Spot Welding, and More
Posted in: Products, Aerospace, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, Power Management, Power Supplies, 3 D Printing & Additive Manufacturing, Custom & Contract Manufacturing, Manufacturing & Prototyping, Rapid Prototyping & Tooling, Materials, Metals, Machinery, Mechanical Components, Robotics
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Software-Defined Analog Filters: A Paradigm Shift in Radio Filter Performance and Capability

In many applications, conventional filters fall short.
Posted in: Articles, Aerospace, Communications, Wireless, Electronic Components, Electronics, Electronics & Computers, RF & Microwave Electronics
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Streamlining Post-Processing in Additive Manufacturing

By focusing just on the AM build process, a fundamental part of the production process chain is often overlooked: post-processing.
Posted in: Articles, Aerospace, Thermal Management, 3 D Printing & Additive Manufacturing, Manufacturing & Prototyping, Materials, Plastics, Measuring Instruments, Test & Measurement, Testing Procedures
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Engineered Solutions for Enclosure Sealing and Insulation

Custom enclosure gaskets can meet a variety of mechanical shock and thermal requirements.
Posted in: Articles, Aerospace, Defense, Electronic Components, Electronics, Electronics & Computers, Thermal Management, Manufacturing & Prototyping, Coatings & Adhesives, Materials, Joining & Assembly, Mechanical Components, Data Acquisition, Sensors
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SDR Interface for the NeXtRAD Multistatic Radar System

Learn about the multistatic data that can be collected on maritime targets.
Posted in: Articles, Aerospace, Defense, Electronics, Electronics & Computers, RF & Microwave Electronics, Data Acquisition, Sensors
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New Manufacturing Process for Monocoque Components

A new process enables large monocoque components to more accurately retain their shape after cooling.
Posted in: Articles, Aerospace Manufacturing and Machining, Aerospace, Electronic Components, Electronics, Electronics & Computers, Thermal Management, Manufacturing & Prototyping, Materials, Plastics, Joining & Assembly, Mechanical Components
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S-Band Radar Systems

Artillery in the wrong hands pose an increased risk to the safety of U.S. service members, allies and civilians.
Posted in: Application Briefs, Defense, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, RF & Microwave Electronics, Semiconductors & ICs
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Metal-Plated, High-Temperature Plastics

Imagine a material that lightens fuel loads and cuts costs every time a rocket blasts off from the launch pad.
Posted in: Application Briefs, Aerospace, Defense, Batteries, 3 D Printing & Additive Manufacturing, Manufacturing & Prototyping, Ceramics, Composites, Materials, Metals, Plastics, Optical Components
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Molecular Engineering for Mechanically Resilient and Stretchable Electronic Polymers and Composites

The ability to predict the mechanical properties of organic semiconductors is of critical importance for roll-to-roll production and thermomechanical reliability of organic electronic devices. This research describes the use of coarse-grained molecular dynamics simulations to predict the density, tensile modulus, Poisson ratio, and glass transition temperature for poly(3-hexylthiophene) (P3HT) and its blend with C60. In particular, it is shown that the resolution of the coarse-grained model has a strong effect on the predicted properties.

Posted in: Briefs, Aerospace, Defense, Electronic Components, Electronics, Electronics & Computers, Composites, Materials, Mechanical Components, Semiconductors & ICs
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