Aries Electronics (Bristol, PA) recently introduced a new thermal profiling solution for its test and burn-in socket line of products. Unlike standard heat-sink and fan options, this solution incorporates advanced thermal profiling software to develop an application/IC specific thermal analysis for each customer’s requirement(s).

Omega’s OM-90 Series are portable, battery operated, temperature (OM-91) and temperature/humidity (OM-92) data loggers. Temperature is measured to an accuracy of ±0.3°C over the range of 5 to 60°C (41 to 140°F) and ±2.0°C over the full range of -30 to 80°C (-22 to 176°F). Relative humidity is measured to an accuracy of ±3.0% RH over the 20 to 80% RH range and ±5.0% RH over the 0 to 100% RH range. Both temperature and relative humidity are logged at a user configurable logging rate which is software selectable.

DDC-I (Phoenix, AZ) recently announced Deos™ Fourpeaks, a verified DO-178 baseline for the Deos real-time operating system with complete Design Assurance Level A (DAL A) certification artifacts. The new baseline supports Deos cache partitioning and slack scheduling, which reduce worst-case execution time and boost overall performance without compromising safety criticality. The new baseline also features support for the ARINC 653 Part 1 Revision 3 specification, which provides the APEX API, scheduling, and time/space partitioning per the latest published ARINC 653 Standard.

Nallatech (Camarillo, CA) has introduced the 510T™ - a GPU-sized 16-lane PCIe 3.0 card featuring two of Altera’s new floating-point enabled Arria 10 FPGAs delivering up to sixteen times the performance of the previous generation. Applications can achieve a total sustained performance of up to 3 TFlops. Deliverables include an optimized Board Support Package compatible with the Altera Software Development Kit (SDK) for OpenCL. This allows the card to be programmed at a high level of abstraction by customers unfamiliar with hardware-based tool flows historically required for FPGAs.

NI (formerly AWR Corporation) (El Segundo, CA) has released version 12 Analyst- MP™ 3D multiphysics finite element method (FEM) electromagnetic (EM) analysis software. This latest version delivers up to 10X improvement in speed from the previous version, making it even faster for analyzing extremely complex high-frequency, multiphysics structures like the X- and Lband accelerators designed by Japan’s High Energy Accelerator Research Organization (KEK).

Pixus Technologies (Waterloo, Ontario) now offers ejector handles and panels for 3U and 6U VPX boards. Designed in Europe, the Pixus Type IV IEEE hot-swap ejector handles feature a rounded base that allow the handle to rock back, providing leverage to insert/remove VPX boards more easily. The handles can engage over 1000N or 225 pounds of force per slot.

W. L. Gore & Associates, Inc. (Gore) (Landenberg, PA) has enhanced its line of GORE™ SKYFLEX™ Aerospace Materials with a new aviation fluid-repellent tape. Available in various sizes, the new sealant tape is well-suited for use on belly fairings, engine nacelles, tail boom covers, fuel bladders and access panels. This gap filling material provides durable, reliable protection in the most demanding conditions, including wide temperature ranges, bending, flexing, and exposure to chemically aggressive aircraft fluids.

Unmanned vehicles are at the forefront of an evolution, especially with the proliferation of the Internet of Things. After decades of serving mission-critical applications in government and defense, the command and control (C2) capabilities of advanced wireless data communications have begun to migrate into the public safety, research, and commercial markets. The robust and secure infrastructure necessary for the eventual proliferation of unmanned vehicles is slowly being realized. Today, however, industries such as public safety, agriculture and oil and gas are being eyed as key markets that can benefit from the use of Remotely Piloted Aircraft (RPA). For several applications, such as wildfire monitoring and border protection, RPAs can even be used to protect people and save lives.

The Navy is developing a vehicle mounted directed energy (DE) weapon system in their Ground Based Air Defense (GBAD) Directed Energy On-The-Move (OTM) program. As part of this initiative, Advanced Cooling Technologies, Inc. (ACT) has been awarded a $1.2M, three year contract to develop an efficient, lightweight, compact thermal storage and management subsystem. The cooling system will remove waste heat from the laser commensurate with available power and other engineering constraints. The technology being developed will be used to suppress unmanned aerial vehicles (UAV’s).