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Sharks on a Plane? Skin Scales Lift Aircraft Design

To improve a flying vehicle, sometimes you have to turn to a reliable model that has been operating for hundreds of millions of years.

Posted in: News, Blog, Aeronautics, Aerospace, Aviation, Defense, Imaging, Visualization Software, 3 D Printing & Additive Manufacturing, Materials, Computer-Aided Design (CAD), Computer-Aided Manufacturing (CAM), Mathematical/Scientific Software, Simulation Software, Software
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Natural DNA-Based Nonvolatile Resistive Switching Memory

Motivated by the demand for an even larger storage capacity in the information era, research efforts have been devoted to the development of more efficient and cost-effective memory elements.

Posted in: Briefs, Aeronautics, Aerospace, Aviation, Data Acquisition, Manufacturing & Prototyping, Composites, Materials, Mechanical Components, Data Acquisition
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Content Addressable Memory (CAM) Technologies for Big Data and Intelligent Electronics Enabled By Magneto-Electric Ternary CAM

Content addressable memory (CAM) is one of the most promising hardware solutions for high-speed data searching and has many practical applications such as anti-virus scanners, internet protocol (IP) filters, and network switches. Since CAM stores the data in its internal memory elements and compares them with the search data in parallel, it can achieve much faster speed compared to the software lookup.

Posted in: Briefs, Aerospace, Communications, Data Acquisition, Defense, Electronic Components, Electronics & Computers, Energy Efficiency, Internet of Things, Materials, Metals, Mechanical Components, MEMs, Semiconductors & ICs, Data Acquisition, Sensors
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Loop Thermosyphons

Two-phase cooling has been utilized in the electronics cooling industry for many decades, with possibly the most well-known adaptation being the heat pipe. Heat pipes are capillary-driven, two-phase devices that rely on the boiling and condensation of a working fluid to transfer heat significant distances with minimal temperature gradient. The flow of the working fluid inside of a heat pipe is facilitated by a capillary wick structure that relies on surface tension to return the condensed liquid to the heat generating components. Heat pipes have found their way into a large number of industries and applications because of their high performance, high reliability, and low cost. Unfortunately, as the electronics industry’s insatiable quest for smaller, higher-powered devices soldiers on, the discrete cooling power of the heat pipe approaches obsolescence.

Posted in: Articles, Aerospace, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, Power Management, Power Supplies, Thermal Management, Design processes, Electronic equipment, Thermal management
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New Products: February 2018 Aerospace & Defense Technology

Rugged Servers with Skylake Architecture

Themis Computer® (Fremont, CA) announced the launch of its next generation XR6 Rugged Enterprise Servers (RES) featuring the newest Intel® Xeon® Scalable (Skylake) Processors.

Posted in: Products, Aeronautics, Aviation, Data Acquisition, Defense, Board-Level Electronics, Computers, Electronic Components, Electronics, Electronics & Computers, Power Management, Power Supplies, Cameras, Imaging, Fastening, Joining & Assembly, Machinery, Mechanical Components
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Additive Manufacturing Materials for RF Components

The Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) Weapons Development and Integration (WDI) Directorate has a program known as PRIntable Materials with Embedded Electronics (PRIME2). PRIME2 will integrate RF and electronics into additive manufacturing processes to reduce size, weight, and overall cost of these components and subsystems. This program will advance the state of the art in printable electronics, and deliver a materials database, process development, modeling, and simulation of 3D-printed objects with embedded conductive elements, passive prototypes, and RF prototypes. PRIME2 will create a new fabrication capability (applied to electronics and RF technology areas), weight reduction, higher reliability, and on-demand (local and immediate) spare components in the field.

Posted in: Articles, Aerospace, Electronic equipment, Embedded software, Research and development, Additive manufacturing, Fabrication
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pH-Dependent Spin State Population and 19F NMR Chemical Shift Via Remote Ligand Protonation in An Iron(II) Complex

The development of transition metal-based molecules and materials that can be switched between low-spin and high-spin electronic states has constituted a highly active area of research over the past several decades. Indeed, the magnetic bistability of such spin-crossover compounds make them potential candidates for molecular switches and chemical sensors, as the spin transition can be controlled by a number of external stimuli, such as temperature, pressure, and light.

Posted in: Briefs, Aerospace, Defense, Electronic Components, Electronics, Electronics & Computers, Materials, Metals, Data Acquisition, Sensors, Measuring Instruments, Test & Measurement
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CompactPCI Serial Space

There are a few open specifications in the embedded industry that have been used in the extreme environments of space over the years. These include VME, CompactPCI, OpenVPX, and MicroTCA. But, prime contractors such as Airbus and others desired a high performance and versatile architecture that was relatively simple and cost-effective. The CompactPCI Serial Space specification was ratified in 2017 to address these requirements, resulting in a compelling architecture for defense and space-based projects.

Posted in: Articles, Aerospace, Communications, Defense, Board-Level Electronics, Electronic Components, Electronics, Electronics & Computers, Measuring Instruments, Test & Measurement, Architecture, Embedded software, Satellites, Spacecraft
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NASA CubeSats: Pushing the Boundaries of Technology

NASA’s Small Spacecraft Technology Program is on the countdown clock to advance communications and proximity maneuvering capabilities for CubeSats with the Integrated Solar Array and Reflectarray Antenna (ISARA) mission.

Posted in: Articles, Aerospace, Antennas, Navigation and guidance systems, Satellite communications, Satellites
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A Mechanistic Analysis of Oxygen Vacancy Driven Conductive Filament Formation in Resistive Random Access Memory Metal/NiO/Metal Structures

Resistive Random Access Memory (RRAM) devices have drawn much interest in the last decade, particularly the concept of a memristor. In this case, the so-called memristance, which provides the relationship between the change in charge (time integral of the current) and flux (time integral of the voltage), is not a constant as in linear elements, but a function of the charge, resulting in a nonlinear circuit element. Applications of such two-terminal electrical devices that provide high densities and low-power operation include, for instance, neuromorphic-type computing elements.

Posted in: Briefs, Aeronautics, Aerospace, Aviation, Defense, Electronic Components, Electronics, Electronics & Computers, Manufacturing & Prototyping, Materials, Metals, Simulation Software, Software
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