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Industrial-Grade Embedded Computers For Harsh Environments

Moxa Technologies, Inc. (Taipei, Taiwan) offers the DA- 660, DA-661, DA-662, and DA-663 models of the ThinkCore RISCbased embedded computers series designed for use in harsh environments. The computers feature 8 or 16 RS-232/422/485 serial ports, multiple Ethernet or fiber ports, and are based on the Intel XScale IXP-422/425 communication processors.

Posted in: Products, Products, Electronics & Computers
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Dual-Processor, Carrier-Grade AdvancedTCA Server Blade

The KAT6200 quad-core AdvancedTCA® blade from Emerson Network Power (Madison, WI) is a field replaceable ATCA server blade featuring a pair of dualcore, Intel Xeon processors, a high-speed ATCA switched fabric, a mid-size AdvancedMC expansion bay, redundant IPMI system management, and an optional 2.5-inch SAS hard drive.

Posted in: Products, Products, Electronics & Computers
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32-Bit CompactPCI Backplane

Elma Bustronic (Fremont, CA) has developed a 3U 32-bit CompactPCI (cPCI) backplane in a 6-slot size. It features hundreds of I/O pins across the backplane that are undefined on the 64-bit version. The backplanes are PICMG 2.16-compliant and utilize controlled-impedance stripline design resulting in virtually zero crosstalk. The Bustronic 32-bit backplane line currently includes a 6U 8-slot and 3U versions in 3, 6, and 8 slots. The company also offers a range of 64-bit cPCI backplanes and various other CompactPCI accessories.

Posted in: Products, Products, Electronics & Computers
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PM Controller with Integrated Control Loop Functionality

Watlow (St. Louis, MO) announces the introduction of its EZZONE ™ PM controller in the popular 1/32nd and 1/16th DIN panel mount package sizes.

Posted in: Products, Products, Electronics & Computers
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Intel Core 2 Duo Mini PC

Stealth Computer Corporation (Toronto, Canada) has introduced the LPC-450 mini PC. Measuring 5.7"(W) x 9.9"(D) x 1.65"(H), the LPC- 450 mini PC features a multitude of I/O connectivity built into its small design such as: Gigabit LAN, Serial, 3-USB 2.0, FireWire, Video, Audio, PS/2 Mouse & Keyboard ports. The LPC-450 has a builtin 2.5" high-shock hard drive with up to 160GB of storage space for archived data.

Posted in: Products, Products, Electronics & Computers
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Cyber-Training Today’s Fighting Forces

Dramatic changes are taking place in the way U.S. service men and women prepare for their assignments. Since 9/11, the U.S. Department of Defense (DoD) is moving from a training cycle in which pre-deployment training events for units and staffs were predictable and occurred every 18-24 months, to one in which deployments are occurring every 10-to-12 months. The Department’s leadership views virtual simulation, where soldiers can experience a wider variety of realistic training scenarios more frequently, as one way to supplement live training to prepare its forces to go into harm's way

Posted in: Articles, Articles, Electronics & Computers, Computer simulation, Virtual reality, Defense industry, Education
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Embedded Development and the .NET Micro Framework

The scenario:

You’ve been assigned the task of designing and producing an embedded device. You’ve been given time, cost and size constraints that impact your design. An initial analysis of the requirements leads you to the conclusion that a 32-bit processor with a relatively small amount of RAM and Flash are required. A bit of research shows that an ARM processor with 2MB of external Flash and 2MB of external RAM will meet your cost and size constraints.

Posted in: Articles, Articles, Electronics & Computers, Architecture, Embedded software, Product development
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Multiscale Virtual Design and Testing of Materials

Progress has been made in research on several fronts in an effort to develop computational simulation capabilities for use in virtual design and testing of advanced structural materials. It is envisioned that the capabilities will be embodied in a coherent set of methods, software to implement the methods, and advances in the fundamental understanding of many issues in the thermomechanical performance of materials. It is further envisioned that the methods and software will be organized into a hierarchy (see figure) corresponding to a hierarchy of spatial scales from electronic through atomic, mesoscale, microstructural, and continuum to macrostructural, and that there will be seamless coupling of information from each scale to the next larger scale. A secondary objective of this research and development effort is to provide direct simulation output at each level of the hierarchy for investigating specific phenomena at the corresponding spatial scale. For the purposes of demonstrating the capabilities and providing specific focus for the overall research, it is intended to predict nano-, micro-, and macroscopic degradation of aluminum and titanium alloys under fatigue loading and in a corrosive (oxidative) environment and as a function of temperature.

Posted in: Briefs, Information Technology, Design processes, Simulation and modeling
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Life Tests of a Microwave MEMS Capacitive Switch

Life tests have demonstrated the longevity of an electrostatically actuated capacitive switch of a microelectromechanical systems (MEMS) type suitable for handling radio signals having frequencies of multiple gigahertz. The tests were performed to contribute to understanding of factors that affect the reliability of MEMS switches in general and of how improvements in designs and materials can increase operational lifetimes of MEMS capacitive switches. The tests were based partly on the concept that data obtained in monitoring both high-speed and low-speed switching characteristics provide valuable insight into quantifying the lifetime properties of the switches and enable estimation of switching lifetimes under a variety of operating conditions.

Posted in: Briefs, Electronics & Computers, Microelectricmechanical device, Switches
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Measuring Corrosion-Related Properties of Coupled Metals

Amethod and apparatus have been conceived for using electrochemical impedance spectroscopy (EIS) for determining rates of corrosion of coupled metals. EIS has been used heretofore for determining rates of corrosion of single metals. However, many structures used in corrosive environments include different metals in electrical contact. Moreover, the concept of using a sacrificial metal to suppress or reduce the corrosion of another metal is applied in some structures. The coupling of two different metals can affect the rates of corrosion of both. Hence, there is a need to extend EIS to coupled metals.

Posted in: Briefs, Physical Sciences, Spectroscopy, Corrosion, Metals
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