Optimizing system resource utilization is a key design objective for system engineers in communications, electronics, and other industries. System resources such as processors, memory, or bandwidth on a communication bus are often shared by various components in the system. To understand the utilization of a shared resource, system engineers must do two things: they must identify constraints on the resource, such as number of processors and memory size, and they must analyze the effect of input traffic or load on the shared resource.

Ethernet is currently the incumbent backplane technology across a wide range of storage, wireless, wireline, military, industrial, and other embedded applications as developers move away from proprietary implementations in an effort to reduce development time and cost while increasing performance and functionality. However, as data rates increase, it has become apparent that many high-performance applications exceed the limits of this traditional protocol. Designing an efficient embedded backplane interconnect with excellent performance requires addressing a number of key design challenges, including header efficiency, protocol processing efficiency, effective bandwidth, and quality of service while strictly managing cost. To meet these challenges, many developers are turning to RapidIO® technology as an alternative to Ethernet.

Software defined radio technology has been widely adopted for new military and aerospace platforms, government signal intelligence and homeland security systems, and now more extensively in commercial wireless voice and data networks as well. These modern communication systems need to squeeze more channels of traffic into an expensive slice of precious radio spectrum. Military and government requirements for secure communications mandate real-time encryption and decryption schemes that must be increasingly more resistant to interception. In multinational theater of war combat operations, communications systems must selectively ensure certain specific links and reliably deny others.

Acceptance of telecom industry standards for rack-mounted server equipment — in the form of the PCI Industrial Computer Manufacturer’s Group (PICMG) standards — is gaining momentum throughout global market channels. The objectives of those standards are certainly attractive in terms of streamlining economy and efficiency for both carriers and telecom equipment manufacturers across a number of areas. Their aim is to reduce development time and costs, as well as to help reduce the total cost of ownership. They are also intended to offer high levels of modularity and configurability while delivering high levels of service availability (99.999% and greater) and supporting appropriate scalability of system performance and capacity.

MEN Micro Inc. (Ambler, PA) has announced the ESMexpress® System-On-Module Standard, a new computing standard in development to be the ANSIVITA 59 (RSE Rugged System- On-Module Express) standard. In conjunction with the new standard, they have also an - nounced the XM1 featuring the first-generation Intel® Atom® processor (Z530 at 1.6 GHz or Z510 at 1.1 GHz) based on 45-nm technology coupled with 1 GB of soldered DDR2 SDRAM for significantly lower power dissipation, reduction in design costs, and space-saving design flexibility. ESMexpress combines this model with advanced cooling technologies, and the latest serial buses and rugged components to ensure safe, reliable operation in harsh environments found in areas as diverse as the railway, avionics, industrial automation, medical engineering and mobile industries.

ESMexpress provides for extreme resistance against shock and vibration. Eight screws secure the module to the carrier board. In addition, a mechanically robust connector specified for MIL and railway applications supports differential signals with up to 8 GHz, features a stacking height of 5 mm with a minimum tolerance of +/-0.3 mm, is equipped with fixed contacts for power supply, and is specified for an operating temperature range of -55°C to +125°C. The Intel-based XM1 offers a screened temperature range of -40°C to +85°C. The electrical signals are distributed on two 120-pin connectors and are only defined for modern serial buses. For PCI Express there are four single lane ports (4 ×1) and one port that can be configured as 1 ×16, 1 ×8, 2 ×4 or 2 ×1. Other ports include three 1-Gigabit Ethernet (also as 10- Gigabit), eight USB, three SATA, SDVO, LVDS, HD Audio, several utility signals, and a single 12V power supply.

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VMETRO (Houston, TX) has released a FPGA Mezzanine Card (FMC/VITA 57) module. The ADC510, available in air-cooled and conduction- cooled rugged versions, integrates two 12-bit 500MHz A/D chips for use in DSP applications such as signal intelligence (SIGINT), electronic counter measures (ECM), and radar. This design, based on the emerging VITA 57.1 standard, makes it easier for developers to integrate FPGAs into their embedded system designs.

The ADC510 supports two Texas Instruments ADS5463 ADC devices, with each device supporting a sampling rate up to 500 MSPS and providing 12-bits of digital output. The ADC device interfaces are routed to the FMC connector to enable an FPGA on a baseboard to directly control and receive data. There is a choice of sample clock sources for the ADC510 including an onboard source that supports sampling rates of 300, 320, 400, and 500 MSPS as well as the ability to utilize an external sample clock. Input and output triggers are provided to enable multiple ADC510 modules to be synchronized to increase the number of input channels.

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Connect One™ (San Jose, CA) offers a reference design and a corresponding evaluation board that bring together Microchip's PIC24FJ64GA006 16-bit microcontroller (MCU) for application control, and the CO2128 iChip for secure, reliable TCP/IP connectivity to LAN and GPRS networks. Using the evaluation board, developers can quickly and easily develop an IP-en abled embedded system where the application resides on the PIC24 MCU and the networking and security are provided by the CO2128 iChip. The evaluation board provides dual-core Internet secure architecture where all con nectivity features are isolated from the application, providing a natural firewall. The PIC24F MCU provides application developers with RS-232/RS-485 serial connections, one serial peripheral interface, eight general-purpose I/O pins, an analog- to-digital converter, and 64 KB Flash and 8 KB RAM memory. With simple integration of an MII or RMII PHY, a 10/100 BaseT Ethernet link can be created. A UART connection allows users to operate at a baud rate of up to 1 Mbps between the PIC24 and the iChip. The CO2128 operates at an industrial temperature range of -40° to +85° C and is RoHScompliant.

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The MTC5070 from Performance Technologies (Rochester, NY) is a highly integrated 1U MicroTCA™- compliant platform that can support up to six mid-size, single AdvancedMC™ (AMC) modules. The fully deployable MicroTCA platform meets the needs for high-performance, cost-effective, and modular processing in low-profile, appliance-style applications. PCI-Express® and Ethernet switching are supported to each slot. Storage is accommodated by direct SATA/SAS slot-to-slot connections between the AMC sites and the onboard platform management subsystem provides MicroTCA compliant carrier and shelf management.

The MTC5070, AdvancedMC modules, and NexusWare® enabling software offer an optimized application-ready foundation for telecom, wireless, aerospace and defense, and commercial applications. The platform features front-to-back cooling, which is critical for NEBS installations, with both push and pull fans to cool up to 40W per mid-size single slot. AC input or DC input options are available with a removable 300 W power supply. The front I/O panel features LEDs, a reset switch, and a platform management console port. The rear panel has dual 10/100/1000 Mb Ethernet uplink ports, a 10/100 Mb Ethernet out-of-band platform management port, power input, and a power switch. For Free Info Visit https://info.hotims.com/15138-406

AIM-USA (St. Omaha, NE) has introduced the new FOMIS and FOL429 fiber optic bus extension systems. The FOMIS (Fiber Optic MILbus Stub Extension) product provides a highly modular and scalable system capable of extending MIL-STD-1553 bus stubs up to 500 meters. FOMIS systems can also be combined with the FOL429 modules to provide up to 500 meter extensions of ARINC429 data links. FOMIS and FOL429 are designed to support test applications, such as vehicle launch sites, anechoic chambers, and engine testing, that require an extended distance between the Unit Under Test (UUT) and the remote test equipment.

The FOMIS system consists of a FOMIS-F (or FOL429-F) Front-End module and FOMIS-L (or FOL429-L) remote/lab module. The Front-End and Lab modules are interconnected via a COTS fiber optic link (62.5/125uM multimode fiber).

EMC resistant housing allows operation in electromagnetic fields up to 200V/m. Options supporting extended temperature and standalone (battery powered) operation are available. The FOMIS-L is housed in a 19" rack mountable chassis. System operation is completely plug and play, and no software or configuration is required.

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Elma Electronic Inc. (Fremont, CA) has introduced a ruggedized ATR chassis for MicroTCA. The MicroTCA chassis is an ARINC 404A Full- Size ATR Long Enclosure, often used in commercial and military aviation. The rugged enclosure features modified front panels that can be secured to the chassis, providing more protection for shock and vibration. Shock absorbers/dampers can also be added to the enclosure for extra protection. Thermal management can be achieved via either convection or conduction-cooling.

The chassis meets the MIL-STD-810E shock/vibration requirements and MIL-STD-461 for electromagnetic interference. The vibration and shock tests were performed according to the IEC 61587 1 and VITA 47 standards in six axes (three spatial axes, with the system rotated by 180 degrees for each axis). The backplane holds six AMCs, one MCH (MicroTCA Carrier Hub), and one power module. Single module slots in the full size are standard, but other configurations are possible with the enclosure's modular design.

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