Missile Defense System Signal Processor

The Aegis Ballistic Missile Defense (BMD) system’s recently upgraded signal processor, designed and developed by Mercury Systems, enables the U.S. Navy to defeat more sophisticated ballistic missile threats and improve target identification capabilities. The technology includes an open architecture BMD computing suite that supports future insertion of off-the-shelf products and third-party components. Mercury’s application-ready subsystems (ARS) are integrated as core technologies in the second-generation Aegis BMD system.

Posted in: Application Briefs, Computer software / hardware, Satellite communications, Missiles

Body-Worn Radio

The Nett Warrior Radio from Thales Communi cations provides soldiers with access to the government’s classified networks at the “Secret” or “Sensitive But Unclassified” level.

Posted in: Application Briefs, Radio equipment, Defense industry

Geomagnetic Motion Tracking Products

Any compass incorporated into a host system requires calibration so that the compass properly compensates for ferrous and magnetic components. If this is not done correctly, heading readings can be very inaccurate.

Posted in: Application Briefs, Calibration, Navigation and guidance systems, Magnetic materials

Developing an Efficient RF Cable Test Suite for the Eurofighter Aircraft

The Eurofighter Typhoon is a state-of-the- art combat aircraft. BAE Systems has been working with other leading aerospace companies to make sure the Eurofighter Typhoon is unparalleled in design and performance.

Posted in: Application Briefs, Electronic equipment, Test equipment and instrumentation, Military aircraft

Three-Dimensional Plastic Part Extrusion and Conductive Ink Printing for Flexible Electronics

Structural electronics, or structronics, seeks to build wiring and electrical interconnects directly into component structures to diminish the need for structural fasteners. A MakerBot Cupcake Computer Numerical Control (CNC) was used to investigate the fabrication of plastic structures by printing, and a Fujifilm Dimatix Materials Printer (DMP) was used to create flexible Printed Circuit Boards (PCBs). After developing processes to make these machines easier to use, others will be able to utilize them to develop structures with integrated electronics.

Posted in: Briefs, Manufacturing & Prototyping, Electronic equipment, Additive manufacturing, Plastics, Parts

Micro-Composite Fabrication via Field-Aided Laminar Composite Processing

Much work has been accomplished since the discovery that particles in a dielectric fluid experience forces when placed in an electric field, including mathematical descriptions of the forces and resulting motion of particles of differing shapes, particle separation and segregation for use in drug delivery, and even the manipulation of long-chain molecules of certain polymers.

Posted in: Briefs, Manufacturing & Prototyping, Fabrication, Composite materials, Polymers

Tin-Based IV-IV Heterostructures Fabricated Using Molecular Beam Epitaxy

The indirect nature of the fundamental energy gap in the elemental semiconductors Si and Ge prevents the use of these materials and their alloys in laser devices. The objective of this work is to fabricate Sn-based IV-IV compounds for finding direct bandgap material. This work focuses on the material system GeSn/Ge, from the growth, characterization, and optical measurement. Experimental evidences on pseudomorphic growth of thick Ge1-xSnx film for Sn composition up to 10% and the direct optical transition are presented.

Posted in: Briefs, Manufacturing & Prototyping, Lasers, Fabrication, Alloys, Semiconductors

Stencil Mask Methodology for Parallelized Production of Microscale Mechanical Test Samples

Over the past decade, there has been considerable progress in the development of new mechanical testing methods to characterize the properties of materials at the micro and nano scales. One common application of these testing methodologies is the measurement of mechanical properties of structures that are physically small in scale, such as the strength of nanowhiskers and MEMS devices. Another common application is the use of small sample testing to gain insight into plastic deformation processes through systematic alteration of the sample dimensions in order to help isolate selected aspects of material behavior. Examples of these studies include the exploration of size-scale strengthening effects, the quantitative measurement and analysis of dislocation avalanches, and the measurement of local property variations in engineering alloys.

Posted in: Briefs, Manufacturing & Prototyping, Materials properties, Nanotechnology, Test procedures

PCIe RAID Controller Cards

StarTech.com (Lockbourne, OH) has released two new PCI Express RAID Controller Cards (SKUs: PEXSAT34RH, PEXSAT34SFF). The new PCIe RAID cards feature Marvell™ HyperDuo SSD Auto-Tiering Technology, an embedded technology for 6Gbps SATA controllers that allows users to combine SATA SSD and HDD drives into a single volume (up to 3 SSD + 1 HDD), while built-in HyperDuo technology discreetly identifies and moves frequently accessed files to the faster SSD drive(s). While providing the improved speed and data throughput (up to 80% SSD performance), the cards still enable all data to be safely stored on a larger capacity HDD. The HyperDuo feature can be configured either at the boot level (no software required) or at the OS level through an intuitive administration GUI console in Windows.

Posted in: Products, Products, Electronics & Computers


LAPIS Semiconductor (San Jose, CA), a ROHM Group Company, recently introduced the ML610Q100 series of low-cost, low-power microcontrollers. The Mini LP Micros’ peripherals around the processing core and non-volatile memory and RAM include: GPIO, PWMs, counter/timer blocks, ADCs and comparators. The devices exhibit very low power consumption in both sleep (1uA typical) and operating modes (3.7mA typical), while executing one instruction per clock cycle at up to 8 MHz clock rates. The microcontrollers are unique in having their timing reference circuit completely integrated within the devices, meaning no external crystal or any other component is required. Some of the devices in the Mini LP Micro series have internal writable Flash RAM, which eliminates the need for external EEPROM for data storage. Their wide supply voltage range (2.7V dc to 5.5Vdc) and temperature range (-40°C to 85°C) allow the Mini LP Micros to be used in battery-powered and energy-harvesting applications located in harsh environments.

Posted in: Products, Products, Electronics & Computers