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Temperature Controller

Oven Industries’ (Mechanicsburg, PA) 5R7-001 temperature controller creates a seamless transition between heating and cooling devices. With a bi- directional or unidirectional H-bridge configuration, the temperature controller has many benefits including user-friendly PC software that makes it quick and simple to change any temperature control configurations, and eliminates signal interference or errant signals. The software also enables the temperature controller to operate as a stand-alone unit. A computer can be connected to the device, for retrieving data. Delivering a load current of .1 to 25 Amps, the controller is RoHS compliant, allows for a set temperature range of -40 to 250 degrees Celsius, has a large program memory space for customization, and offers 0-36 VDC output using a split power supply system.

Posted in: Products, Products, Electronics & Computers
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Photo-Etched Lead Frames

Photofabrication Engineering (PEI) (Milford, MA) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a variety of applications including semiconductors, glass-to-metal seals, and relays, as well as medical applicationss. Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin. PEI’s lead frames range in thickness from 0.5 mil [0.0127 mm] to 40 mil [1.575 mm], with features as small as 4 mil [0.10 mm] on 0.010 in. [0.254 mm] centers, creating lead frames that are strong enough to be handled yet flexible enough to allow bending when necessary.

Posted in: Products, Products, Electronics & Computers
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2 GHz RF Source

Crystek Microwave (Fort Meyers, FL) has announced the release of a 2 GHZ RF Source, the CRFS75-2000. Crystek designed the module using proprietary circuitry and SAW (surface acoustic wave) resonator technology to provide ultra-low jitter/phase noise performance with true SineWave output. The resulting source features -134 dBc/Hz phase noise at 10 KHz offset and a noise floor of -164 dBc/Hz. Crystek's CRFS75-2000 comes in a 0.75 in. x 0.75 in SMT package. With 5 V input voltage, it generates a true-sinewave with +5 dBm min. output power. The new source has no sub-harmonics; second harmonic is -20 dBc typical. Frequency accuracy is rated at +/- 150 ppm. The CRFS75- 2000 operates from -40°C to +85°C.

Posted in: Products, Products, Electronics & Computers
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C40 Heatsink System

Ohmite Manufacturing (Arlington Heights, IL)recently introduced their high performance C40 Heatsink System with modular cooling benefits. Designed to provide engineers with a variety of cooling options, the C40 heatsinks feature flexible board mounted modular assembly that can be used in conjunction with up to four TO-247 and TO-264 power resistors, or similarly packaged passive and active components. These 58mm heatsinks can be used individually or in compact paired configurations. Patented camming clips (sold separately) easily secure the devices in place without the need for holes or screws. In order to create active cooling and enhance their thermal capacity in back-to-back paired operations, the C40 heatsinks include pre- configured mounting holes to accommodate a standard 40mm x 40mm fan.

Posted in: Products, Products, Electronics & Computers
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OpenVPX HDS Data/Graphics Processing Module

OpenVPX™ systems operating Serial RapidIO(R) or 10Gigabit Ethernet data plane architectures can process data and graphic information faster with the HDS6502 (High Density Server) module from Mercury Systems (Chelmsford, MA). HDS6502 is a potent integration of Mercury packaging/cooling technology, implementation of Mercury firmware and the latest Intel processors. Mercury’s POET (Protocol Offload Engine Technology) firmware implemented data plane bridge, dual 2.4GHz 4th Generation Quad-core Intel i7-4700EQ processors with native AVX2 (Advanced Vector Extensions 2.0), on-die GT2 GPUs, and Gen 3 PCIe interfaces are supported with 16GB 1600MHz DDR3 SDRAM of system memory.

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Modular Backplane System

Molex Incorporated (Lisle, IL) has announced a high-performance connector system designed specifically to enable PCB developers in the video, commercial broadcast and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints. The RF DIN 1.0/2.3 Modular Backplane System features a unique bracket housing design, which enables an expansion capability of up to 10 ports for increased orthogonal PCB mating flexibility. The modular board-to-board system offers multiple options including a standard four port, 75 Ohm contact version or customizable six, eight and 10 ports with 50 Ohm contacts. The DIN 1.0/2.3 interface allows up to 1.00 mm of axial engagement tolerance.

Posted in: Products, Products, Electronics & Computers
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Three-Dimensional Plastic Part Extrusion and Conductive Ink Printing for Flexible Electronics

Structural electronics, or structronics, seeks to build wiring and electrical interconnects directly into component structures to diminish the need for structural fasteners. A MakerBot Cupcake Computer Numerical Control (CNC) was used to investigate the fabrication of plastic structures by printing, and a Fujifilm Dimatix Materials Printer (DMP) was used to create flexible Printed Circuit Boards (PCBs). After developing processes to make these machines easier to use, others will be able to utilize them to develop structures with integrated electronics.

Posted in: Briefs, Manufacturing & Prototyping, Electronic equipment, Additive manufacturing, Plastics, Parts
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Micro-Composite Fabrication via Field-Aided Laminar Composite Processing

Much work has been accomplished since the discovery that particles in a dielectric fluid experience forces when placed in an electric field, including mathematical descriptions of the forces and resulting motion of particles of differing shapes, particle separation and segregation for use in drug delivery, and even the manipulation of long-chain molecules of certain polymers.

Posted in: Briefs, Manufacturing & Prototyping, Fabrication, Composite materials, Polymers
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Tin-Based IV-IV Heterostructures Fabricated Using Molecular Beam Epitaxy

The indirect nature of the fundamental energy gap in the elemental semiconductors Si and Ge prevents the use of these materials and their alloys in laser devices. The objective of this work is to fabricate Sn-based IV-IV compounds for finding direct bandgap material. This work focuses on the material system GeSn/Ge, from the growth, characterization, and optical measurement. Experimental evidences on pseudomorphic growth of thick Ge1-xSnx film for Sn composition up to 10% and the direct optical transition are presented.

Posted in: Briefs, Manufacturing & Prototyping, Lasers, Fabrication, Alloys, Semiconductors
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Stencil Mask Methodology for Parallelized Production of Microscale Mechanical Test Samples

Over the past decade, there has been considerable progress in the development of new mechanical testing methods to characterize the properties of materials at the micro and nano scales. One common application of these testing methodologies is the measurement of mechanical properties of structures that are physically small in scale, such as the strength of nanowhiskers and MEMS devices. Another common application is the use of small sample testing to gain insight into plastic deformation processes through systematic alteration of the sample dimensions in order to help isolate selected aspects of material behavior. Examples of these studies include the exploration of size-scale strengthening effects, the quantitative measurement and analysis of dislocation avalanches, and the measurement of local property variations in engineering alloys.

Posted in: Briefs, Manufacturing & Prototyping, Materials properties, Nanotechnology, Test procedures
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