Electronics & Computers

Next-Generation Fire Support Systems Boost Lethality

Soldiers view live-stream full-motion video from unmanned aerial vehicles via a smartphone. They access 3-D digital maps to send precision target coordinates. Soldiers are now relying on these advanced technologies to improve lethality and maintain battlefield dominance. These are among the improvements that will be embedded in future fire-support capabilities because the Army has started testing four upgraded systems for its Field Artillery units to provide more accurate and timely fire support to maneuver formations.

Posted in: News, Communications, Wireless, Data Acquisition, Defense, Electronics & Computers
Read More >>

Radar Signal Generation with a High-Performance AWG

Radar ensures the safety and security of the skies, and lives depend on it. That’s why radar design measurements call for high frequency, realistic stimulus signals. You need to create these complex radar test signals at high frequencies, but what’s the best solution?

Posted in: White Papers, White Papers, Aerospace, Defense, Electronics & Computers, RF & Microwave Electronics
Read More >>

Introduction to Electromagnetic Compatibility

By definition, Electromagnetic Compatibility (EMC) describes the ability of a system, a piece of equipment, or some other electrical device that utilizes electromagnetic energy, to operate in its intended environment without suffering an unacceptable degradation in its performance, or negatively impacting the ability of another device to perform its intended function.

Posted in: White Papers, White Papers, Aeronautics, Defense, Electronics & Computers
Read More >>

NRL Develops Novel Monolayer Ferroelectric Hybrid Structures

Domains consisting of electric polarization dipoles are written in a checkerboard pattern into a thin film of lead zirconium titanate (PZT) with a conductive atomic force microscope, and imaged with the same instrument (left panel). Both intensity and spectral distribution of the photoluminescence emitted from a monolayer of tungsten disulphide (WS2) transferred onto the PZT surface is strongly modulated by these polarization domains (right panel). (U.S. Naval Research Laboratory)

Scientists at the U.S. Naval Research Laboratory (NRL), Materials Science and Technology Division, have demonstrated that the intensity and spectral composition of the photoluminescence emitted from a single monolayer of tungsten disulphide (WS2) can be spatially controlled by the polarization domains in an adjacent film of the ferroelectric material lead zirconium titanate (PZT). These domains are written in the PZT using a conductive atomic force microscope, and the photoluminescence (PL) is measured in air at room temperature. Because the polarization domain wall width in a ferroelectric can be as low as 1-10 nm, this approach enables spatial modulation of PL intensity and the corresponding carrier populations with potential for nanoscale resolution.

Posted in: News, Defense, Electronic Components, Electronics, Integrated circuits, Microelectromechanical devices, Microscopy, Semiconductor devices
Read More >>

Open Standard Middleware Enables New HPEC Solutions

The military embedded computing landscape has been transformed from where it was 20 years ago — and that has been almost entirely enabled by the ability of prime contractors, systems integrators, and OEMs to leverage the products of COTS manufacturers who take leading edge commercial technologies and apply them successfully to the world of military computing. A look at the commercial landscape today reveals cell phones that are putting vast amounts of location- aware information — and the ability to process that information — directly into the hands of consumers. The Internet of Things has become a deployable reality, with data derived from millions of connected sensors.

Posted in: Articles, Aerospace, Communications, Defense, Electronics & Computers, Sensors, Architecture, Computer software and hardware, Internet of things, Military vehicles and equipment
Read More >>

Cooling Your Embedded System: What Can Your Open Standard Architecture Handle?

Embedded computing systems for Mil/Aero applications are often conduction-cooled in an ATR or nonstandard chassis. However, there are many designs that require 19" rackmount systems with forced-air cooling. As more processing performance is packed into tight spaces, enclosures that provide advanced cooling options are increasingly common.

Posted in: Articles, Aerospace, Defense, Thermal Management, Computer software and hardware, Embedded software, Cooling, Mountings, Fans
Read More >>

Evaluating Key Certification Aspects of Multicore Platforms for Safety Critical Avionics Applications

High performance, low power consumption and small footprint requirements imposed by the embedded market on the processor industry is causing a definite move away from single-core processors to multicore processors. Multicore processors have been deemed as the future of Size, Weight, and Power (SWaP) constrained applications like military and avionics. They provide higher performance (MHz/W) at lower power. They also allow consolidation of multiple functions/ applications onto a single platform.

Posted in: Articles, Aerospace, Aviation, Defense, Electronics & Computers, Avionics, Computer software and hardware, Safety critical systems, Certification
Read More >>

Upgraded Electronic Flight Bag System

Astronautics Corporation of America Milwaukee, WI 414-449-4000www.astronautics.com

Astronautics Corporation of America has been selected to provide an improved and upgraded electronic flight bag (EFB) system on all fielded and future production Boeing 787 Dreamliner airplanes. The new Block Point Five (BP5) EFB will be a form/fit replacement for Astronautics’ current Boeing EFB. The BP5 will give Boeing 787 operators additional functionality and will be compatible for use throughout all phases of airplane operations.

Posted in: Application Briefs, Aviation, Defense, Electronics & Computers, Stability control, Electronic control systems, Spacecraft
Read More >>

Development of High Quality 4H-SiC Thick Epitaxy for Reliable High Power Electronics Using Halogenated Precursors

New approaches to synthesizing SiC epitaxial layers could improve electronics performance.

Development of robust semiconductor devices with high energy efficiency and reliability is a key objective towards 'Energy Conversion and Power Management ' for naval system applications. The goal of this research is to create the fundamental knowledge needed for the development of novel approaches to synthesize high-quality, thick SiC epitaxial layers (> 100μm) for reliable high voltage (≥10kV) / high power (>100 kW) electronics for navy ship applications.

Posted in: Briefs, TSP, Aerospace, Defense, Electronics & Computers, Semiconductor devices, Research and development, Materials properties, Marine vehicles and equipment
Read More >>

Silicon Based Mid-Infrared SiGeSn Heterostructure Emitters and Detectors

(a) A cross-sectional schematic of the GeSn p-i-n photodiode. (b) Dark I-V characteristics of the three samples. (c) Spectral response of the samples measured at zero bias. (d) Calculated responsivity of the samples.

Enhancing the performance of GeSn p-i-n photodiodes using gold metal nanostructures.

The goal of this research project was to advance the science and technology of silicon-based photonic devices using SiGeSn heterostructures. Such devices work in mid-IR spectral range and form the foundation for mid-IR photonics that enable on-chip systems for applications ranging from vibrational spectroscopy, chem/bio sensing, medical/health uses, to environmental monitoring. This project was mostly directed toward improving GeSn detectors with the use of surface plasmons induced by carefully designed metal nanostructures. The goal was to replace the current mid-IR detectors that are usually photodiodes made from narrow bandgap III-V or II-VI semiconductor compounds such as InGaAs, InSb, HgCdTe (MCT) or type-II In-GaAs/InGaSb superlattice. These photodiodes are incompatible with the CMOS process and cannot be easily integrated with Si electronics. The GeSn mid-IR detectors developed in this project are fully compatible with the CMOS process.

Posted in: Briefs, TSP, Electronics & Computers, Semiconductors & ICs, Integrated circuits, Sensors and actuators, Silicon alloys
Read More >>